Surface-Mount Component With Stepped Connection Pad Positioning
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Solution Overview
Problem
Existing surface-mount microwave electronic components face challenges in precise three-dimensional positioning of connection pads, leading to potential solder embrittlement, short-circuits, and impedance breaks, while also failing to meet electromagnetic compatibility and sealing requirements due to their design.
Innovation Solution
A surface-mount electronic component with a housing featuring connection pads having a central conductive part and an electrical insulating element with a shoulder, where the through-hole is offset and the insulating element's smaller section projects inside the case, preventing transverse movement and ensuring precise contact and electromagnetic compatibility, with a sealed casing design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the component size is reduced to operate at higher frequencies, then the operating frequency is improved, but the positioning precision of connection pads deteriorates
Solution Approach 1:
The patent introduces a stepped cylindrical structure with multiple diameters along the vertical axis, transforming a two-dimensional positioning problem into a three-dimensional solution. The different diameters (first diameter larger than second diameter) create distinct positioning interfaces at different heights, enabling precise localization in the vertical dimension while maintaining horizontal positioning accuracy despite miniaturization.
Solution Approach 2:
The connection pad is divided into multiple functional segments: a first cylindrical portion for mechanical positioning, a second cylindrical portion for electrical connection, and a head portion for soldering. This segmentation allows each part to optimize its function independently, with the positioning portion ensuring accuracy regardless of overall component size reduction.
2Ease of manufacture
If the connection pad structure is simplified for easier manufacture, then the ease of manufacture is improved, but the positioning precision and electrical contact reliability deteriorate
Solution Approach 1:
The stepped cylindrical design adds vertical dimensionality to an otherwise simple circular pad structure. This maintains manufacturing simplicity (still essentially a rotational extrusion process) while adding precise positioning capability through the diameter transition, which naturally locates the pad without requiring complex mechanical fixtures.
Solution Approach 2:
The patent changes the geometric parameter of the connection pad from a uniform cylinder to a stepped cylinder with varying diameters. This parameter change enables the pad to simultaneously achieve easy manufacture (through standard extrusion processes) and high positioning precision (through the geometric constraint of the diameter transition zone).
3Device complexity
If conventional connection pad designs are used, then the device complexity is reduced, but the reliability of solder connection deteriorates due to embrittlement and misalignment
Solution Approach 1:
By extending the connection pad structure vertically with stepped diameters, the patent creates a self-aligning mechanism that compensates for positioning variations during assembly. The larger first diameter provides a positioning interface that guides the pad into correct alignment, while the smaller second diameter ensures proper solder joint formation, thereby improving reliability without significantly increasing overall complexity.
Solution Approach 2:
The stepped structure anticipates potential positioning errors by providing a tolerance-absorbing transition zone. The diameter change creates a mechanical constraint that pre-compensates for alignment variations, preventing solder embrittlement and misalignment issues before they occur during the soldering process.
4Ease of operation
If the connection pad head is made larger for better solder contact, then the ease of operation is improved, but the positioning precision in three dimensions deteriorates
Solution Approach 1:
The patent resolves the conflict between head size and positioning precision by utilizing the vertical dimension. The head portion has a larger diameter for solder accessibility, while the upper cylindrical portion has a smaller diameter for precise positioning. This vertical differentiation allows both large solder contact area and high positioning precision to coexist without compromising either function.
Data Source
Figure 1
Figure 2
Figure 3A~3C
AI summary
This is a surface-mount electronic component comprising a housing (20), an electronic circuit (22) within the housing, and several connection pads (35) for connecting the electronic circuit (22) to a printed circuit board (100). Each pad (35) has a central conductive portion (36) of the nail type with a core (36.1) for connection to the electronic circuit (22) and a head (36.2) for connection to the printed circuit board (100), and an electrical insulating element (37) surrounding the central core (36.1). The insulating element (37) is a ring having two portions (37.1, 37.2) of different cross-sections defining a shoulder (37a). The housing (20) has a base (20b) with a through hole (38) for each stud (35), this hole (38) opening outside the housing (20), in a recessed area (20c) external to the base (20b), the shoulder (37a) being abutted against the recessed area (20c), the part with the smallest cross-section (37.1), projecting into the housing (20) through the hole (38), the head (36.2) and the part with the largest cross-section (37.2) remaining outside the housing (20).