Semiconductor Package Stepped Passivation Isolation
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Solution Overview
Problem
The challenge in semiconductor packaging is the formation of bump bridges between adjacent conductive bumps, which limits the implementation of fine bump pitches in stacked semiconductor packages, especially in three-dimensional chip stacking techniques.
Innovation Solution
A semiconductor package design that includes a first semiconductor chip structure with a conductive bump bonded to a bump pad within a recessed stepped portion of a second semiconductor chip structure, using a glue layer to isolate and fill the stepped portion, preventing bump bridges and allowing for a finer bump pitch without using a printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a fine bump pitch is implemented in stacked semiconductor packages, then the number of I/O terminals and integration density increase, but bump bridges form between adjacent conductive bumps
Solution Approach 1:
The passivation layer is segmented to form a stepped portion that divides and isolates adjacent conductive bumps. This segmentation creates physical separation between bumps, preventing bump bridge formation while allowing fine bump pitch implementation for increased I/O terminals.
Solution Approach 2:
The stepped portion of the passivation layer acts as an intermediary structure between adjacent conductive bumps. This intermediate feature provides isolation and prevention of bump bridge formation, enabling reliable fine bump pitch designs with increased terminal count.
2Productivity
If the bump pitch is reduced to increase integration, then more I/O terminals are achieved, but the risk of bump bridge defects increases
Solution Approach 1:
The passivation layer is divided into stepped portions that create isolated regions around each conductive bump. This segmentation maintains manufacturing precision by preventing bump bridge defects even when bump pitch is reduced for higher integration density.
Solution Approach 2:
The stepped portion creates local structural variation in the passivation layer, providing enhanced isolation precisely where needed around adjacent bumps. This local quality modification enables fine bump pitch while maintaining defect prevention.
3Reliability
If a stepped portion is formed in the passivation layer to prevent bump bridges, then fine bump pitch is realized, but the device structure becomes more complex
Solution Approach 1:
The passivation layer is segmented into stepped portions that provide bump bridge prevention. While this adds structural feature, the segmentation is achieved through standard semiconductor fabrication processes, managing the complexity increase.
Solution Approach 2:
The stepped portion introduces a vertical dimension variation in the passivation layer structure. This dimensional change provides effective bump isolation while maintaining compatibility with existing manufacturing processes, balancing reliability improvement with controlled complexity.
Data Source
AI summary
The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.