Stepped PCB Composite for High-Power Thermal Management
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Solution Overview
Problem
Existing electronic modules with high-power components face challenges in heat management, leading to overheating and material wastage due to the need for larger printed circuit boards that are not mechanically stable enough for further processing.
Innovation Solution
A stepped printed circuit board composite is created by overlapping a thermally critical IMS printed circuit board with an FR4 printed circuit board, supported by a heat sink with extended contact surfaces and support elements, allowing for efficient heat dissipation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large IMS printed circuit board is used to provide sufficient thermal surface area for high-power components, then heat dissipation is improved, but material cost increases and mechanical stability decreases
Solution Approach 1:
The printed circuit board is divided into two distinct parts: an IMS substrate providing thermal management for high-power components, and an FR4 substrate providing cost-effective areas for other components. This segmentation allows each material to be used only where necessary, optimizing both thermal performance and material cost.
Solution Approach 2:
Different regions of the printed circuit board are assigned different materials based on local requirements: IMS material is used specifically in regions requiring high thermal conductivity (under high-power components), while FR4 material is used in regions where cost is more critical and thermal demands are lower.
2Temperature
If a large IMS printed circuit board is used to provide sufficient thermal surface area for high-power components, then heat dissipation is improved, but mechanical stability worsens
Solution Approach 1:
The printed circuit board uses a composite structure combining IMS and FR4 substrates. The IMS portion provides thermal management where needed, while the FR4 portion contributes to overall mechanical stability and structural rigidity, creating a balanced composite system that achieves both thermal and mechanical performance.
3Loss of substance
If a hybrid FR4/IMS printed circuit board is used to reduce material cost, then manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: fabricating the IMS substrate, fabricating the FR4 substrate, and then assembling them together. This segmentation allows each substrate to be manufactured using optimized processes for its specific material requirements, reducing overall manufacturing complexity compared to attempting to create a monolithic hybrid board.
4Loss of substance
If the IMS printed circuit board area is reduced to match only the thermal requirements, then material cost decreases, but handling and further processing becomes difficult
Solution Approach 1:
The FR4 substrate acts as a mechanical support structure that provides sufficient overall board area for stable handling and processing, while the smaller IMS portion is optimized purely for thermal management. This composite approach allows the board to be handled like a traditional full-size PCB while using expensive thermal material only where absolutely necessary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a cost-optimized, mechanically stable electronic module that efficiently manages heat and reduces material usage, enabling the integration of high-power components like LEDs in motor-vehicle lighting while maintaining precise positioning and handling like a classic flat assembly.
Implementation Method 1
a fastening side of the at least one printed circuit board B rests flat on a contact surface of the heat sink
Data Source
AI summary
The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (16) formed. Supporting elements (23, 24, 25, 26) are formed on the contact face (21) of the heat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.