Stepped Pin Mechanism for Semiconductor Stage Substrate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor manufacturing devices require a large number of pins and corresponding holes in the stage for vertically moving substrates and focus rings, leading to complexity and a preference for minimizing the number of holes.
Innovation Solution
A semiconductor manufacturing device with a stage having a first region for mounting substrates and a second region for focus rings, where pins extend through holes intersecting the mounting surface, allowing for vertical movement of both with a small number of pins, utilizing a driving unit and control unit to manage the pins' position for lifting and unloading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a large number of pins are used to vertically move substrates and focus rings, then the substrate and focus ring can be moved independently, but the device complexity increases and the number of holes required in the stage increases
Solution Approach 1:
Each pin is designed with a stepped structure having a first upper end surface and a second upper end surface at different heights. The same pin can contact either the substrate (at the higher second upper end surface) or the focus ring (at the lower first upper end surface), allowing one pin to perform multiple functions. This multi-functionality enables independent movement of both substrate and focus ring while using fewer pins, directly resolving the technical contradiction.
2Manufacturing precision
If many holes are formed in the stage for pin insertion, then each pin can be positioned accurately, but the stage structure becomes more complex and manufacturing becomes more difficult
Solution Approach 1:
The stepped structure of each pin allows it to serve multiple purposes from a single hole location. The same hole and pin combination can accommodate either substrate processing or focus ring adjustment, eliminating the need for separate holes for each function. This reduces the total number of holes required in the stage while maintaining precise positioning capability, thereby improving ease of manufacture without sacrificing positioning accuracy.
Data Source
AI summary
A semiconductor manufacturing device includes a stage, a plurality of pins, and a driving unit. The stage includes a mounting surface. The mounting surface has a first region for mounting thereon a substrate, and a second region for mounting thereon a focus ring. The second region is provided to surround the first region. A plurality of holes is formed in the stage. The holes extend in a direction that intersects the mounting surface while passing through the boundary between the first region and the second region. The pins are provided in the respective holes. Each of the pins has a first and a second upper end surface. The second upper end surface is provided above the first upper end surface, and is offset towards the first region with respect to the first upper end surface. The driving unit moves the pins up and down in the aforementioned direction.