Stepped Sensor Element for Printed Conductor Inspection

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Solution Overview

Problem

Existing contactless inspection methods for conductor track structures on flat carriers, such as those in liquid crystal displays, face challenges in achieving precise multi-channel measurements due to geometric constraints and are not suitable for complex trace matrices with a large number of pixels, requiring a high degree of parallelism and precise sensor electrode arrangement.

Innovation Solution

A sensor element with a stepped substrate design featuring a raised upper area and recessed lower area, allowing for space-saving wiring and precise positioning of sensor electrodes, enabling compact, multi-channel measurement capabilities and efficient inspection of complex conductor track structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contactless inspection methods are used for conductor track structures on flat carriers, then non-contact measurement is achieved, but precise multi-channel measurements cannot be performed due to geometric constraints

Engineering Contradiction:
Improvecontactless measurement capabilityVSAvoidmulti-channel measurement precision
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The substrate is structured with a stepped design featuring a raised upper area and a recessed lower area, creating vertical dimensionality. Sensor electrodes are positioned on the raised upper area at a controlled distance from the conductor track structure, while connection lines extend through the transition area to the recessed lower area for electrical contact. This three-dimensional arrangement enables simultaneous contactless measurement capability and precise multi-channel electrical connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If sensor electrodes are arranged in one plane for parallel measurement, then measurement speed increases, but wiring complexity increases due to space constraints

Engineering Contradiction:
Improveparallel measurement speedVSAvoidwiring complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The stepped substrate structure utilizes vertical space by raising the upper area where sensor electrodes are positioned and recessing the lower area where connection lines terminate. This dimensional separation allows multiple sensor electrodes to be arranged in one plane for parallel measurements while connection lines can route through the transition area to the recessed lower area without spatial interference, reducing wiring complexity despite high channel count.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If sensor electrodes are positioned close to each other for high parallelism, then inspection efficiency increases, but maintaining consistent measurement distance becomes difficult

Engineering Contradiction:
Improveinspection efficiencyVSAvoidmeasurement distance consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The raised upper area of the substrate provides a localized platform with controlled geometry where sensor electrodes are positioned. The specific geometric parameters of the raised area (dimensions, height, shape) are optimized to maintain consistent distance between the sensor electrodes and the conductor track structure beneath, even when electrodes are closely spaced for high parallelism. This localized geometric control ensures measurement distance consistency while enabling high inspection efficiency.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise and efficient contactless inspection of conductor track structures on flat carriers, allowing for simultaneous scanning of numerous measuring points with consistent measurement distance, effectively addressing the limitations of existing methods by ensuring high planarity and accurate detection of defects in conductor track matrices.

Implementation Method 1

Due to the strong distance dependency, especially of capacitive measuring methods, when parallelizing the conductor path inspection, it must be ensured that the individual sensor electrodes used are geometrically within a few μm in a flat plane.

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentEP1987367B1Sensor element, device and method for inspecting a printed conductor structure, production method for sensor element
Publication Date: 2011.05.18 SIEMENS AG
  • EP1987367B1 patent drawingFigure 1
  • EP1987367B1 patent drawingFigure 2A~2B
  • EP1987367B1 patent drawingFigure 3A~3C

AI summary

The invention relates to a sensor element for inspecting a printed conductor structure (131) that is mounted on a flat support (130). The sensor element (250) comprises a substrate (251), which is mechanically structured in such a way that it has a raised upper region (260) and lowered lower region (280) said planar upper (260) region and lowered lower region (280) being interconnected by a preferably step-type transition region (270). The sensor element (250) also comprises a plurality of sensor electrodes (261), arranged on the planar upper region (260) and a plurality of connecting conductors (471) for electrically connecting the plurality of sensor electrodes (261). A connecting conductor (471) is connected to each sensor electrode (261), said conductor extending from the respective sensor electrode (261) to the lowered lower region (280). The invention also relates to a device and a method for inspecting a printed conductor structure (131), in addition to a production method for the aforementioned sensor element.