Stepped Semiconductor Sidewalls for Stronger Resin Anchoring
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Solution Overview
Problem
Existing semiconductor devices face challenges in ensuring strong adhesion to resin packaging due to limited surface area on side surfaces, leading to potential peeling issues during sealing.
Innovation Solution
A semiconductor device with a quadrangular substrate having step sections on its side surfaces, formed by alternately repeating protruding and recessed portions, and a manufacturing method involving crack formation along specific crystal planes to increase surface area and facilitate resin anchoring, ensuring secure adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the side surface of the semiconductor substrate is kept flat, then the manufacturing process is simple, but the adhesion to resin is insufficient leading to peeling issues
Solution Approach 1:
The side surface is segmented into multiple protruding portions and recessed portions along the thickness direction, creating a stepped structure. This segmentation increases the effective adhesion area between the semiconductor substrate and resin, preventing peeling while maintaining manufacturing feasibility through controlled cracking along crystal planes.
Solution Approach 2:
The invention transitions from a flat two-dimensional side surface to a three-dimensional stepped structure by utilizing the thickness direction. The step sections create additional surface area in the vertical dimension, providing enhanced anchoring for resin without significantly increasing horizontal footprint.
2Reliability
If cracks are formed along {11−20} plane or {1−100} plane, then the cracking process is straightforward, but the resulting side surface does not provide sufficient resin anchoring
Solution Approach 1:
The invention applies different crystal plane orientations at different locations along the side surface. By controlling cracks to form at specific angles relative to the <100> direction, local step sections with protruding and recessed portions are created, providing enhanced resin anchoring at critical adhesion points while maintaining overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased surface area on side surfaces due to the step sections enhances resin anchoring, restricting peeling and ensuring robust adhesion between the semiconductor device and resin, thereby improving the reliability of the semiconductor device.
Implementation Method 1
forming a plurality of cracks by pressing a pressing member against a front surface of the metal layer along a plurality of planned dividing lines
Implementation Method 2
dividing the semiconductor wafer and the metal layer using the plurality of cracks as a plurality of starting points by pressing a dividing member against the second surface
Data Source
AI summary
A semiconductor device includes a semiconductor substrate having a quadrangular shape when viewed from above and having a front surface, a rear surface opposite to the front surface, and four side surfaces connecting the front surface and the rear surface. Each of the side surfaces has a step section in which a plurality of protruding portions and a plurality of recessed portions alternately and repeatedly appear along a direction in which a peripheral edge of the front surface of the semiconductor substrate extends.