Stepped Solder Pad Interface for Compact Sensor Footprint
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Solution Overview
Problem
There is a need for test and measurement devices, particularly sensors, with a smaller footprint to minimize disruption and allow for multiple units to be placed on an article under observation, while maintaining connectivity through stacked contact pads.
Innovation Solution
A sensor device with a substrate and a solder pad interface featuring a plurality of steps at different planes, each with a solder pad, and a cable configuration with leads that connect to these pads, minimizing volumetric space and allowing for a reduced size without compromising connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional planar contact pads are used for connectivity, then the device footprint is larger, but the connection reliability is sufficient
Solution Approach 1:
The contact pads are arranged in a stepped configuration along the Z-axis (vertical dimension) rather than spreading out in the XY-plane. This vertical stacking of contact pads at different heights allows multiple connection points to be achieved within a compact footprint, resolving the contradiction between small area and reliable connectivity.
2Area of stationary object
If the sensor device size is reduced, then more units can be placed on the article under observation, but the connectivity complexity increases
Solution Approach 1:
By utilizing the vertical dimension for contact pad arrangement, the patent achieves compact connectivity without increasing planar footprint. The stepped configuration naturally organizes multiple connection points in a structured manner, managing connectivity complexity within a small form factor.
Solution Approach 2:
The contact pads are nested vertically at different heights, with each pad positioned on a different level of the stepped structure. This nesting approach allows multiple connection points to be packed into a compact volume, reducing the overall device footprint while maintaining all necessary connectivity.
Data Source
AI summary
A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad.