Stepped Stage Insulating Film Structure for Void-Free Corners
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Solution Overview
Problem
Conventional thermal spraying methods struggle with gaps or voids at the corners of stages, leading to reduced withstand voltage and adhesion strength, which compromises the reliability of semiconductor device stages.
Innovation Solution
A stage design with an insulating film featuring alternating first and second layers on recessed surfaces, formed through thermal spraying, ensures uniform thickness and adhesion strength at corners by alternating end portions, preventing gaps and voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer insulating film is formed by thermal spraying on the stage, then the manufacturing process is simple, but gaps or voids occur at corners leading to reduced withstand voltage and adhesion strength
Solution Approach 1:
The insulating film is divided into multiple segments (first insulating film and second insulating film) with different materials and properties. The first insulating film provides base insulation while the second insulating film enhances adhesion strength and fills gaps at corners, creating a segmented structure that resolves the contradiction between simplicity and reliability.
Solution Approach 2:
The patent uses composite materials by combining different insulating materials in layers. The first insulating film and second insulating film have different material compositions, creating a composite structure that leverages the advantages of each material to achieve both high withstand voltage and strong adhesion at corners.
2Manufacturing precision
If the thermal spraying machine sprays all surfaces continuously, then the process is efficient, but the insulating film thickness becomes non-uniform at corners
Solution Approach 1:
The manufacturing process is segmented into distinct cycles: a first cycle forms the insulating film on specific surfaces (top, bottom, or side surfaces) while avoiding corners, and a second cycle forms the film on remaining surfaces including corners. This segmentation ensures uniform thickness while maintaining reasonable productivity.
Solution Approach 2:
The first insulating film is formed in advance on surfaces where uniform thickness is critical, before forming the second insulating film on corners and remaining surfaces. This preliminary action ensures that areas requiring precise thickness control receive the appropriate film deposition first.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stage achieves improved adhesion strength and withstand voltage, ensuring excellent insulating properties and reliability, even with complex geometries.
Implementation Method 1
forming a first layer by thermal spraying from a thermal spraying machine on a first surface recessed from a top surface of a base material while moving the thermal spraying machine along a plane substantially parallel to the top surface of the base material, and forming a second layer by thermal spraying from the thermal spraying machine on a second surface recessed from a side surface of the base material
Data Source
AI summary
A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.