Stepped Substrate Packaging for Mixed-Thickness Electronic Components
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Solution Overview
Problem
Existing electronic component packages face challenges in efficiently accommodating components with different thicknesses, leading to increased manufacturing costs due to the need for precise spacer and wire bond electrical connections.
Innovation Solution
A method and apparatus that utilize substrates with conductive materials and steps formed on their inward-facing surfaces, allowing for the mounting of electronic components with varying thicknesses, eliminating the need for spacers and reducing handling complexity by using a lead frame with extended input/output leads and insulative fill material to secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spacers and wire bond electrical connections are used to accommodate electronic components with different thicknesses, then electrical connectivity is achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent removes spacers and wire bond connections from the assembly process. Instead, it uses a lead frame with extended leads that directly contact the conductive materials on both substrates, eliminating unnecessary components and simplifying the manufacturing process while maintaining electrical connectivity
Solution Approach 2:
The lead frame serves multiple functions: it provides mechanical support, establishes electrical connections between components of different thicknesses, and eliminates the need for separate spacers and wire bonds. This multi-functional approach reduces device complexity while ensuring reliable electrical connectivity
2Reliability
If spacers and wire bond connections are used to accommodate electronic components with different thicknesses, then electrical connectivity is achieved, but manufacturing costs increase
Solution Approach 1:
The patent eliminates spacers and wire bond connections, reducing the bill of materials and manufacturing steps. The lead frame with extended leads directly provides electrical connectivity, reducing component costs and assembly expenses
Solution Approach 2:
The lead frame serves as a cost-effective, single-use structure that provides both mechanical support and electrical connectivity. By using a simple, inexpensive lead frame instead of expensive spacers and wire bonds, the overall manufacturing cost is reduced while maintaining functional requirements
3Manufacturing precision
If spacers are used to accommodate electronic components with different thicknesses, then components are positioned, but handling complexity increases
Solution Approach 1:
The patent removes spacers from the assembly, eliminating the need for precise placement operations. The lead frame with extended leads naturally accommodates components of different thicknesses without requiring individual positioning, reducing handling complexity
Solution Approach 2:
The lead frame structure automatically adapts to components of varying thicknesses through its extended leads that contact the conductive materials on both substrates. This self-adjusting mechanism eliminates the need for precise manual positioning, reducing handling complexity while maintaining manufacturing precision
Data Source
AI summary
An apparatus includes a pair of substrates with conductive material formed on portions of inwardly facing surfaces thereof, and a step formed in or on the conductive material on one of the pair of substrates. A lead frame having leads and electronic components having different respective thicknesses are mounted between the conductive materials on the pair of substrates. The step has a step thickness dimensioned to facilitate electrical contact between a thickest one of the electronic components or the leads with the step in the conductive material on one of the pair of substrates and the conductive material on the one other of the pair of substrates. An electrical signal path is formed between the electronic components or the leads disposed in electrical contact with the step and the conductive material on the one other of the pair of substrates.