Stepped Mounting Substrate Insulation for Light-Emitting Modules
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Solution Overview
Problem
Existing mounting substrates often experience defects in insulating properties during manufacturing, which can affect the performance and reliability of light-emitting modules.
Innovation Solution
A mounting substrate design featuring a first mounting portion, a second mounting portion, and an insulating portion, where the insulating portion is strategically placed between the first and second upper surfaces, covering only specific regions, to minimize defects and enhance insulating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating portion is provided between mounting portions at different heights, then the insulating property is improved, but the manufacturing precision may deteriorate due to alignment difficulties
Solution Approach 1:
The insulating portion extends not only horizontally between mounting portions but also vertically along the side surfaces, utilizing the third dimension (height) to enhance insulation effectiveness. This multi-dimensional configuration ensures that insulation is maintained across different height levels while providing a larger coverage area that compensates for alignment tolerances.
Solution Approach 2:
The insulating portion is designed to extend beyond the immediate boundaries of mounting portions, creating a preliminary buffer zone that anticipates potential alignment variations during manufacturing. This over-extension ensures that even if alignment is not perfectly precise, the insulating coverage remains effective.
2Device complexity
If the insulating portion covers only specific regions, then the manufacturing complexity is reduced, but the insulating coverage may be insufficient
Solution Approach 1:
The insulating portion is segmented into multiple functional regions: a first insulating region covering the lower mounting portion, a second insulating region covering the upper mounting portion, and a connecting insulating region bridging between them. This segmentation allows each region to be optimized independently while collectively providing comprehensive insulation coverage.
Solution Approach 2:
The insulating portion采用嵌套结构，其中第一绝缘区域、第二绝缘区域和连接绝缘区域相互嵌套配合，形成层层递进的绝缘防护。这种嵌套设计在提供充分绝缘覆盖的同时，避免了冗余材料的浪费，实现了复杂性与覆盖率的平衡。
Data Source
AI summary
A light-emitting module includes a mounting substrate and a light-emitting device. The mounting substrate includes first and second mounting portions and an insulating portion. The first mounting portion has a first upper surface. The second mounting portion has a second upper surface at a position higher than a position of the first upper surface. The insulating portion covers only a part of a region of the first upper surface, only a part of a region of the second upper surface, and a region between the first upper surface and the second upper surface. The light-emitting device has a lower surface mounted on the mounting substrate so as to overlap with at least a part of the first mounting portion, at least a part of the second mounting portion, and at least a part of the insulating portion in a top view.