Stepped Support Member for Laser Scribing LED Reliability
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Solution Overview
Problem
Existing LED devices face challenges in reliability and efficient fabrication methods, particularly during the laser scribing process, which can damage the light emitting structure due to concentrated energy.
Innovation Solution
A light emitting device with a support member having a stepped portion on its side surface, allowing for minimized damage during laser scribing by spacing the laser energy impact, and a method involving sequential semiconductor layer formation, isolation etching, and laser scribing to separate individual units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat support member is used for laser scribing, then the fabrication process is simple, but the laser energy concentrates on a small area causing damage to the light emitting structure
Solution Approach 1:
The support member transitions from a flat two-dimensional surface to a three-dimensional stepped structure. By creating multiple levels or tiers on the support member, the laser energy is distributed across different vertical levels rather than concentrating on a single flat surface. This dimensional change effectively reduces the energy density at any single point, preventing damage to the light emitting structure while maintaining fabrication feasibility.
2Reliability
If laser scribing is performed on a flat surface, then the process is fast, but the energy concentration damages the light emitting structure
Solution Approach 1:
The support member is divided into multiple stepped levels, creating distinct separation zones for different fabrication stages. The isolation etching creates grooves between light emitting structures, and the stepped portions provide intermediate levels that allow laser scribing to occur at different heights. This segmentation enables the laser to cut through materials at different levels without concentrating all energy on the final separation line, thus protecting the light emitting structure while achieving precise separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and efficiency of LED device fabrication by reducing damage during the laser scribing process and improving the separation of individual units, leading to improved light emitting device performance and packaging.
Implementation Method 1
performing a laser scribing process along the chip boundary region to separate a plurality of light emitting devices into individual light emitting device units
Data Source
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AI summary
Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting unit. The light emitting device (100) includes a support member (170) having a stepped portion (172) on a side surface, a light emitting structure (110) on the support member, the light emitting structure including a first conductive type semiconductor layer (112), an active layer (114), and a second conductive type semiconductor layer (116) to generate light, and an electrode (175) supplying a power to the first conductive type semiconductor layer. The support member has a first surface on which the light emitting structure is disposed and a second surface having an area greater than that of the first surface.