Stepped Support Radar Component Signal Bunching
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Solution Overview
Problem
Current radar-based distance measurement devices face challenges in achieving high power efficiency and accurate fill level detection at higher frequencies due to parasitic elements and signal attenuation, especially above 60 GHz, which limits the resolution and accuracy of fill level measurement.
Innovation Solution
An electronic component with a semiconductor chip and a support structure that allows for perpendicular bunching of radar signals, utilizing a stepped surface to enhance signal focusing and reduce the need for external bunching measures, enabling efficient emission and reception of radar signals at frequencies above 100 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hybrid connection technologies (bond wires, solder locations) are used to connect semiconductor chip to circuit card, then electrical connection is achieved, but parasitic elements disturb the transfer behavior and cause signal attenuation at frequencies above 100 GHz
Solution Approach 1:
The patent combines the semiconductor chip with the support structure (circuit card) into a monolithic integration where the chip is directly mounted on the support without external conductive traces, soldered connections, or bond wires. This merging eliminates the parasitic elements introduced by hybrid connection technologies and enables reliable signal transfer at millimeter wave frequencies above 100 GHz
2Area of stationary object
If the primary radiator emits radar signals in the complete half space, then signal coverage is maximized, but signal power is dispersed and bunching angle cannot be controlled
Solution Approach 1:
The patent introduces a vertical dimension by creating a step structure on the support surface. The semiconductor chip is mounted on this step, which has a height corresponding to a quarter-wavelength or whole-number multiple thereof. This dimensional change causes the radar signals to be emitted and received perpendicular to the support surface, concentrating the beam in a specific direction rather than dispersing it across the entire half space, thereby achieving controlled bunching angle and improved measurement precision
3Measurement precision
If a large aperture lens or parabolic reflector is used to bunch the radar signal, then bunching angle is controlled, but total reflection losses increase significantly
Solution Approach 1:
The patent changes the geometric parameter of the support structure by introducing a step with a specific height (quarter-wavelength or whole-number multiple). This parameter change enables the radar signals to be automatically bunched perpendicular to the support surface without requiring large aperture lenses or parabolic reflectors, thereby controlling the bunching angle while minimizing total reflection losses and improving power efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a safe, efficient, and exact distance measuring device capable of achieving high resolution and error-free fill level detection by optimizing the bunching of radar signals, reducing total reflection losses, and increasing the power efficiency of the measurement process.
Implementation Method 1
the surface of the support is preferably embodied electrically conductively at least in the region of the first step
Implementation Method 2
the first step is embodied in such a manner that the radar signal in the case of emitting and/or receiving is bunched approximately perpendicularly to the surface of the support
Data Source
AI summary
The present disclosure relates to an electronic component for the bunched emitting and/or receiving of radar signals. For this, the electronic component comprises: a semiconductor chip, which is embodied to emit and/or to receive the radar signal by means of a primary radiator, and a support, on whose surface the semiconductor chip is arranged for electrical contacting. According to the present disclosure, the surface of the support has at least a first step embodied in such a manner that the radar signal in the case of the emitting and/or receiving is bunched approximately perpendicularly to the surface of the support. In this way, the electronic component-of the present disclosure is suited especially for those applications of radar based distance measurement, which benefit from bunched emitted and received radar signals.