Stepped Terminal Through Hole for Semiconductor Bonding Strength
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Solution Overview
Problem
Semiconductor devices used in high-load environments, such as electric vehicles and power conversion systems, face reliability and longevity issues due to weak bonding between electrodes and terminals, particularly under high temperature and vibration conditions.
Innovation Solution
A semiconductor device design featuring a terminal with a through hole having a step portion, where a bonding material covers the step portion and is in contact with the electrode, enhancing the bonding strength and anchor effect, and a manufacturing method involving the use of sintered materials or adhesives with high thermal conductivity to ensure reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a through hole without step portion is used in the terminal, then the device complexity is reduced, but the bonding strength between the electrode and terminal deteriorates
Solution Approach 1:
The invention transitions from a simple cylindrical through hole to a stepped through hole structure with multiple levels. The step portion creates an additional bonding surface area within the terminal, allowing the bonding material to form stronger mechanical interlocking with both the electrode and terminal body, thereby enhancing bonding strength without significantly increasing overall device complexity.
Solution Approach 2:
The through hole is segmented into multiple levels with different diameters, creating distinct bonding zones. The step portion divides the single bonding interface into multiple bonding surfaces, enabling the bonding material to establish stronger connections at different levels, which resolves the contradiction between bonding strength and structural simplicity.
2Reliability
If a bonding material is applied to cover the step portion, then the reliability under high temperature and vibration is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The stepped structure is pre-formed in the terminal before bonding material application. This preliminary structural preparation creates natural bonding zones that guide the bonding material flow and distribution, reducing the precision requirements during the bonding process while ensuring reliable mechanical interlocking and electrical connection under high temperature and vibration conditions.
3Reliability
If a stepped through hole structure is used, then the anchor effect is enhanced, but the difficulty of detecting and measuring the bonding quality increases
Solution Approach 1:
The invention utilizes visual inspection methods where the stepped structure creates distinct visual levels and surfaces. The bonding material filling the stepped through hole can be visually detected through the terminal openings, allowing quality control personnel to assess bonding completeness and anchor effect through color and surface level differences without complex measurement equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced bonding strength and anchor effect improve the reliability and longevity of semiconductor devices, enabling them to operate effectively in high-temperature and high-vibration environments, while also reducing the risk of cracking and void formation.
Implementation Method 1
In the step of bonding the terminal, the second bonding material is heated to bond the terminal to the electrode with the second bonding material interposed
Implementation Method 2
a bonding material having flowability is supplied to inside of the through hole to bond the terminal to the electrode with the bonding material interposed
Data Source
AI summary
Provided are a semiconductor device with a bonding strength ensured between an electrode of a semiconductor element and a terminal, and a power conversion device including the semiconductor device. A semiconductor device includes: a semiconductor element having an electrode; a substrate; a terminal; and a bonding material. The terminal has a through hole and has a step portion in the inside of the through hole. The bonding material covers the step portion in the inside of the through hole and is in contact with the electrode of the semiconductor element.