Stepped Ultrasonic Probe Connection Component
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Solution Overview
Problem
Current ultrasonic probes with 2-D matrix transducer array elements face challenges in interconnection due to dense and intricate circuitry, exceeding the manufacturing capacity of FPCs and PCBs, with high registration requirements and costs.
Innovation Solution
A connection component for array elements with multiple layers and conductive elements is introduced, providing sufficient space for signal transmission lines and simplifying the interconnection process through a stepped shape, allowing for efficient connection between array elements and signal transmission lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional FPCs and PCBs are used for interconnection in 2-D matrix ultrasonic probes, then the circuitry can connect array elements, but the manufacturing complexity and costs increase significantly due to dense and intricate circuitry exceeding manufacturing capacity
Solution Approach 1:
The patent divides the interconnection system into separate functional components: a connection component with connection surfaces for array elements and a signal transmission line component with substrate layers. This segmentation allows each component to be optimized independently, reducing overall manufacturing complexity while maintaining reliable interconnections between array elements.
2Manufacturing precision
If traditional interconnection methods are used for 2-D matrix ultrasonic probes, then array elements can be connected, but the manufacturing costs increase due to high registration requirements and intricate circuitry
Solution Approach 1:
The connection component acts as an intermediary between array elements and signal transmission lines. It provides standardized connection surfaces that simplify the interfacing process, reducing registration requirements and manufacturing difficulties while maintaining precise electrical connections.
Solution Approach 2:
The patent transitions from planar circuit board interconnections to a multi-layer stacked architecture with connection components positioned between substrate layers. This dimensional change allows signals to route through multiple levels, reducing the need for dense lateral routing and simplifying manufacturing.
3Reliability
If dense circuitry is used to connect all array elements in 2-D matrix, then complete signal transmission is achieved, but the manufacturing capacity of FPCs and PCBs is exceeded
Solution Approach 1:
By segmenting the interconnection system into modular components (connection component with connection surfaces, signal transmission line component with substrate layers), the patent enables parallel manufacturing processes. Each module can be fabricated independently and assembled, significantly improving manufacturing productivity while maintaining complete signal transmission across all array elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective interconnection of signal transmission lines with array elements, reducing manufacturing complexity and costs while maintaining the integrity of the ultrasonic probe's performance.
Implementation Method 1
A transducer includes an array element assembly, a connection component for array elements, and a signal transmission line component. Each array element includes a piezoelectric element and a backing block connected to the piezoelectric element
Implementation Method 2
The transducer is a core part of the ultrasonic probe, which consists generally of a matching layer, a wafer, a flexible printed circuit board (FPC) and a backing block
Data Source
AI summary
A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.