Stepped Via Electrodes in Multilayer Ceramic Capacitors
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Solution Overview
Problem
Existing methods for manufacturing miniaturized thin-film multilayer ceramic capacitors (MLCCs) are complex and costly, requiring multiple processes to form via electrodes, which affects the performance and reliability of these capacitors.
Innovation Solution
A method involving the formation of via electrodes with a stepped shape, where the width increases from the substrate to the upper portion of the ceramic body, allowing multiple internal electrodes to be connected through a single via electrode, reducing manufacturing complexity and increasing capacitance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple via electrodes are formed to connect internal electrodes in miniaturized thin-film MLCCs, then capacitance reliability is improved, but manufacturing complexity and costs increase
Solution Approach 1:
Multiple via electrode functions are merged into a single via electrode structure. The via electrode has a stepped shape with multiple levels, where each level connects to different internal electrodes. This single multi-level structure replaces what would traditionally require multiple separate via electrodes, thereby maintaining capacitance reliability while reducing manufacturing complexity and costs.
Solution Approach 2:
The via electrode transitions from a simple vertical structure to a stepped three-dimensional structure with multiple levels. By adding the horizontal dimension through steps, a single via electrode can connect to multiple internal electrodes at different levels, achieving the function of multiple via electrodes through dimensional transformation.
2Reliability
If the number of laminated layers is increased to maintain capacitance in miniaturized MLCCs, then capacitance is maintained, but manufacturing complexity increases
Solution Approach 1:
The via electrode is designed with multi-functionality to serve multiple connection purposes. The stepped structure allows different portions of the via electrode to connect to different internal electrodes simultaneously, making a single structure perform the function of multiple connection points, thereby reducing the need for additional laminated layers.
3Ease of manufacture
If a single via electrode connects multiple internal electrodes, then manufacturing process is simplified, but connection reliability may be compromised
Solution Approach 1:
The via electrode is segmented into multiple stepped levels, where each level provides a separate connection interface with different internal electrodes. This segmentation within a single continuous structure maintains connection reliability by providing multiple independent connection paths while keeping the manufacturing process simple.
Data Source
AI summary
A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.