Stepped Wafer Jig Structure for Warp-Safe SiC Processing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Silicon carbide wafers are prone to warping and damage during transportation and processing, and they often have compatibility issues with processing equipment due to dimensional incompatibilities.

Innovation Solution

A wafer jig with a ring-shaped side wall and step portions that provide a gap and buffer space to prevent deformation and damage, and a method for bonding and separating wafers using thermocompression or oxide layer bonding, allowing for compatibility with larger processing equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If silicon carbide wafers are thinned to increase the number of wafers that can be processed, then productivity is improved, but the wafers become prone to warping and damage

Engineering Contradiction:

Improvenumber of wafers processedVSAvoidwafer integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies beforehand cushioning by designing a wafer jig with a ring-shaped side wall that includes a first step portion and a second step portion. The first step portion provides support close to the wafer edge to prevent warping, while the second step portion positioned farther from the edge provides cushioning protection against damage during transportation and processing. This preemptive structural design protects thinned wafers from deformation and breakage.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Manufacturing precision

If wafers are made with certain dimensions to meet specific processing requirements, then manufacturing precision is improved, but compatibility with processing equipment is worsened

Engineering Contradiction:

Improvewafer dimension specificationVSAvoidequipment compatibility

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent applies the intermediary principle by introducing a wafer jig as a mediator between the wafer and the processing equipment. The jig has a specific dimension (e.g., 8 inches) that matches the equipment requirements, while the wafer itself maintains its required dimension (e.g., 6 inches). The ring-shaped side wall with step portions provides mechanical support and positioning, enabling the wafer to be processed in equipment with different size specifications without compromising manufacturing precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the ring-shaped side wall is positioned close to the wafer edge to prevent warping, then wafer stability is improved, but the risk of damage during separation is increased

Engineering Contradiction:

Improvewafer flatnessVSAvoidwafer damage risk

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent applies segmentation by dividing the support function into two distinct step portions: the first step portion is positioned close to the wafer edge to provide support for preventing warping and maintaining flatness, while the second step portion is positioned farther from the edge to provide a safety buffer zone. This segmented approach allows the wafer to remain stable during processing while reducing the risk of damage during separation, as the second step portion acts as a protective barrier.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wafer jig stabilizes silicon carbide wafers, preventing warping and breakage, and ensures compatibility with processing equipment by providing a gap and buffer space, while enabling separation without damage.

Implementation Method 1

A wafer is bonded to the supporting surface

Methodology Applied

Scientific EffectThermocompression bonding:

Implementation Method 2

bonding and separating wafers using thermocompression or oxide layer bonding

Methodology Applied

Scientific EffectOxide layer bonding:

Data Source

PatentUS12512359B2Wafer jig, wafer structure and wafer processing method

Publication Date: 2025.12.30 GLOBALWAFERS CO LTD

AI summary

Provided is a wafer jig including a bottom wall and a ring-shaped side wall. The bottom wall has a supporting surface. The ring-shaped side wall is connected to a periphery of the bottom wall. The ring-shaped side wall includes at least two step portions. The two step portions include a first step portion and a second step portion. The first step portion is connected between the supporting surface and the second step portion, and the first step portion protrudes along a direction toward a center of the bottom wall. The ring-shaped side wall surrounds the center. In addition, a wafer structure and a wafer processing method are also provided.