Stepwise Power Converter Cooling Plate for Vibration Resilience
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Solution Overview
Problem
Power conversion devices in hybrid and electric vehicles face performance degradation due to heat generation, requiring an effective cooling structure that also considers the rigidity against external vibrations.
Innovation Solution
A power conversion device with a cooling structure featuring stepwise-shaped wall portions, extended connection portions, and ribs to enhance rigidity, along with a peripheral frame forming a secondary flow channel to increase coolant flow speed and reduce component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional cooling structure with flat wall portions is used, then the manufacturing is simple, but the rigidity against vibration is insufficient
Solution Approach 1:
The wall portions are divided into multiple levels with different heights, creating a stepwise structure. This segmentation increases rigidity by distributing mechanical stress across multiple levels while maintaining manufacturability through standard fabrication processes.
Solution Approach 2:
The structure transitions from a two-dimensional flat wall to a three-dimensional stepwise form by varying the height of different wall portions. This dimensional change enhances rigidity without significantly increasing manufacturing complexity, as the steps can be integrated into the existing cooling plate design.
2Reliability
If separate cooling structures are used for different electronic components, then the cooling can be optimized for each component, but the device complexity and component count increase
Solution Approach 1:
Multiple cooling functions are merged into a single integrated cooling structure. The cooling plate incorporates multiple flow channels at different levels, allowing simultaneous cooling of various electronic components through one unified structure rather than separate cooling systems.
Solution Approach 2:
The cooling plate serves multiple functions: it provides structural support, creates flow channels for coolant, and acts as a mounting surface for electronic components. This multi-functionality reduces the overall component count while maintaining effective cooling for each component.
3Productivity
If the flow channel cross-sectional area is increased, then the coolant flow resistance decreases, but the device volume increases
Solution Approach 1:
The flow channels are positioned at different vertical levels within the cooling plate, utilizing the third dimension (height) to create parallel flow paths. This allows increased total flow capacity without expanding the horizontal footprint of the device.
Solution Approach 2:
Multiple flow channels are nested within the thickness of the cooling plate, with channels at different heights. This nesting approach allows the system to accommodate higher coolant flow rates while maintaining a compact overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced rigidity and cooling efficiency improve the device's performance and allow for downsizing by integrating structural elements, thereby addressing both thermal management and vibration resilience.
Implementation Method 1
Heat generated by the semiconductor device is transferred to the coolant via the first base member
Implementation Method 2
a coolant that flows through a first flow channel formed by a first wall portion and a second wall portion facing with each other
Data Source
AI summary
A power conversion device includes a cooling structure capable of cooling down, by a coolant that flows through a first flow channel formed by a first wall portion and a second wall portion facing with each other, a first electronic component and a second electronic component mounted on an external surface of the first wall portion. The first wall portion is formed in a stepwise shape, and includes a first mount portion on which the first electronic component is mounted, a second mount portion which has a different height from the first mount portion, and on which the second electronic component is mounted, and a first connection portion that is extended between the first mount portion and the second mount portion.