Stepwise Heatable Plate for Strip Carrier Heating
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Solution Overview
Problem
Conventional methods for heating strip-shaped carriers in ovens face inefficiencies, such as slow cooling and potential overheating, and require loop-shaped buffers that can cause components to shift during the soldering process.
Innovation Solution
A heatable plate is moved stepwise through the oven to efficiently heat the carrier from the bottom, with vacuum assistance for improved heat transfer, and a component placement device with a matching movement mechanism to prevent buffer loops and component shifting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional oven is used to heat the carrier, then the components can be heated and soldered, but the cooling process is slow and the carrier may overheat
Solution Approach 1:
The heating system is segmented into multiple independent heating zones along the carrier path, allowing different sections to be heated or cooled independently. This enables faster cooling by selectively deactivating specific heating zones while maintaining others, reducing overall cooling time and preventing overheating.
Solution Approach 2:
The heating elements operate periodically rather than continuously, with controlled on/off cycles that allow the carrier to cool between heating phases. This periodic heating action prevents overheating while maintaining soldering temperature when needed, and significantly reduces cooling time compared to conventional continuous heating ovens.
2Stability of the object's composition
If loop-shaped buffers are used to compensate for conveyance irregularities, then the carrier can be buffered upstream and downstream of the oven, but components may shift relative to the carrier
Solution Approach 1:
The system uses dynamic synchronization between the component placement device and oven movement, where both devices coordinate their motions in real-time. The oven and placement device move together with matched velocities and positions, eliminating the need for loop buffers while maintaining component-carrier alignment throughout the process.
Solution Approach 2:
A feedback control system monitors the positions of the carrier, oven, and component placement device, continuously adjusting their movements to maintain precise synchronization. This feedback mechanism ensures components remain accurately positioned relative to the carrier during heating, eliminating the need for buffer loops that cause shifting.
3Object-affected harmful factors
If the oven is made movable to prevent overheating, then the carrier can be cooled during malfunction, but switching off the oven is not viable due to slow cooling
Solution Approach 1:
The heating system is divided into multiple independent heating zones that can be selectively activated or deactivated. During malfunction, specific zones can be switched off while others remain active, enabling controlled cooling of affected areas without requiring the entire oven to cool down, thus preventing overheating while maintaining productivity.
Solution Approach 2:
Different sections of the carrier are subjected to different thermal conditions simultaneously. When overheating is detected in a specific zone, only that local area is cooled by deactivating its heating element, while other zones continue heating. This localized thermal control prevents overheating without causing system-wide cooling delays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for simple and efficient heating of strip-shaped carriers, preventing overheating and ensuring components remain stable during the process by maintaining a consistent contact with the heatable plate, thereby fixing components effectively without the need for undesirable loop-shaped buffers.
Implementation Method 1
The heatable plate may efficiently heat the lower side of the carrier
Implementation Method 2
the carrier may be drawn against the plate by means of vacuum. The vacuum may ensure that good heat transfer occurs between the heatable plate and the carrier
Data Source
AI summary
According to a method and a device for heating a strip-shaped carrier in an oven, a carrier is passed through the oven in a direction of conveyance. The carrier is supported by a heatable plate, which together with the carrier is moved through the oven stepwise with a predetermined step size from a starting position to an end position.