Stereo Camera Housing Adhesive Bonding Thermal Warpage
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Solution Overview
Problem
Existing stereo camera apparatuses are susceptible to changes in environmental conditions, such as temperature, which affect the position and posture relation between camera units, leading to inaccuracies in calculations like distance imaging.
Innovation Solution
A stereo camera apparatus design where the housing and circuit board are bonded using an adhesive applied only on the short side in the base line length direction, with the housing made of materials like aluminum alloys and the circuit board of fiber-reinforced plastics, minimizing warpage and maintaining camera unit alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the housing and circuit board are bonded by adhesive over a large area, then the bonding strength is improved, but the influence of temperature change on camera unit position and posture increases
Solution Approach 1:
The adhesive application region is segmented into a specific shape where the length in the base line length direction is shorter than the length in the orthogonal direction. This segmentation reduces the adhesive's influence on thermal expansion in the critical base line direction while maintaining sufficient bonding strength through the orthogonal dimension.
Solution Approach 2:
The adhesive region is designed with non-uniform dimensions, having different lengths in the base line length direction versus the orthogonal direction. This local quality variation allows the adhesive to provide bonding strength while minimizing its impact on thermal deformation in the base line direction, thereby reducing temperature-induced position and posture changes.
2Area of stationary object
If the adhesive application region is made larger in the base line length direction, then the bonding area is increased, but the warpage and deformation of the circuit board increase
Solution Approach 1:
The adhesive application region is segmented with a specific aspect ratio, where the dimension in the base line length direction is intentionally made shorter than the orthogonal dimension. This segmentation strategy increases the effective bonding area through the orthogonal dimension while limiting the adhesive's span in the base line direction, thereby reducing circuit board warpage and deformation.
Solution Approach 2:
The adhesive region is designed with asymmetric dimensions relative to the camera units, creating a shape where the length in the orthogonal direction exceeds the length in the base line length direction. This asymmetric configuration optimizes bonding area while minimizing thermal expansion effects on circuit board shape.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the influence of temperature changes on the position and posture relation between camera units, enhancing the accuracy of distance calculations and reducing deformation-related errors.
Implementation Method 1
it is possible to reduce an influence of a temperature change on a position and posture relation between camera units
Data Source
AI summary
A stereo camera apparatus includes a housing, a first camera unit attached to the housing, a second camera unit attached to the housing, a processing device that performs image processing by using captured images acquired by capturing of the first camera unit and the second camera unit, and a circuit board on which the processing device is mounted. In the housing, a base length direction of the first camera unit and the second camera unit is a longitudinal direction, the housing and the circuit board are bonded to each other by an adhesive, and in a region in the housing, onto which the adhesive is applied, a length in the base line length direction is shorter than a length in an orthogonal direction that is a direction perpendicular to the base length direction.