Chip-on-Tip Stereo Endoscope Packaging for Autoclave Sterilization
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Solution Overview
Problem
Endoscopes with chip-on-tip architecture face significant challenges in protecting delicate optical and electronic components from high pressure, high temperature, and moisture exposure during autoclave sterilization, particularly due to size constraints in small diameters.
Innovation Solution
The endoscope system incorporates a chip-on-tip architecture with specialized protective features, including synchronized emitter and image sensor operations, moisture and pressure management systems, and robust packaging to withstand autoclave sterilization conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional endoscope protective features are used, then the endoscope can be sterilized, but the delicate optical and electronic components cannot withstand autoclave sterilization conditions
Solution Approach 1:
The endoscope is divided into two separate parts: a sterilizable outer assembly and a non-sterilizable inner assembly containing the delicate optical and electronic components. The outer assembly can undergo autoclave sterilization while the inner assembly is protected and removed before sterilization, eliminating exposure of sensitive components to harmful sterilization conditions.
Solution Approach 2:
The inner assembly containing the image sensor, processor, and other electronic components is extracted from the outer assembly before sterilization. This extracted inner assembly is handled separately and never exposed to autoclave conditions, while the outer assembly undergoes complete sterilization independently.
2Measurement precision
If chip-on-tip architecture is implemented for advanced visualization, then high-resolution stereo imaging is achieved, but the space-constrained environment makes component protection more difficult
Solution Approach 1:
The chip-on-tip architecture components (image sensor, processor, memory) are segmented into a separate inner assembly that can be handled independently. This segmentation allows the complex electronic components to be protected as a unit, simplifying the protective structure by treating them as a removable module rather than requiring individual protection for each component.
Solution Approach 2:
The inner assembly containing the chip-on-tip components is nested within the outer assembly during normal operation, allowing the complex components to be housed within the simpler outer structure. During sterilization, the inner assembly is extracted, leaving the outer assembly for sterilization, thus nesting the complex within the simple when needed.
3Reliability
If the endoscope undergoes autoclave sterilization, then effective sterilization is achieved, but moisture and pressure damage the internal components
Solution Approach 1:
The endoscope is segmented into an outer assembly that can withstand moisture and pressure for sterilization, and an inner assembly containing moisture-sensitive electronic components. The outer assembly undergoes autoclave sterilization while the inner assembly is protected by being removed and handled separately, eliminating moisture and pressure exposure to sensitive components.
Solution Approach 2:
The outer assembly acts as an intermediary that can be sterilized independently. By sterilizing the outer assembly separately from the inner assembly, the system achieves effective sterilization of the portions that can withstand it while protecting sensitive components through the intermediary sterilization approach.
Data Source
AI summary
Endoscope assembly suitable for repeated re-processing utilizing autoclave sterilization techniques. An endoscope includes a handpiece and an insertion tube attached to the handpiece, wherein the insertion tube comprises a sidewall, and wherein the sidewall comprises an interior surface and an exterior surface. The endoscope includes a cover plate attached to the interior surface of the sidewall of the insertion tube, and a window attached to the cover plate. The endoscope includes a fiber optic ferrule disposed within the insertion tube, wherein the fiber optic ferrule is configured to receive a distal fiber optic bundle, wherein the fiber optic ferrule is attached to the cover plate at the illumination hole such that electromagnetic radiation transmitted by the distal fiber optic bundle passes through the illumination hole of the cover plate.