Semiconductor Package Stiffener Marking for Uniform Chip Cooling
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Solution Overview
Problem
The existing methods for thermally connecting semiconductor chips to radiators using liquefied metals face challenges due to surface irregularities and wettability issues caused by writing information on the chip surface, leading to uneven distribution of the thermally conductive material and reduced cooling performance.
Innovation Solution
The proposed solution involves writing information on sections outside the semiconductor chip's surface and using a thermally conductive material with fluidity between the chip and radiator, ensuring even heat transfer and maintaining the chip's surface flatness, thereby enhancing cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If information is written on the semiconductor chip surface by lasering or inking, then identification capability is improved, but surface flatness deteriorates and wettability uniformity deteriorates
Solution Approach 1:
The patent divides the chip surface into two functional zones: an information writing area (peripheral region) and a thermally conductive material application area (central region). By segmenting the surface usage, information can be written without affecting the flatness and wettability of the central area where the thermally conductive material must spread evenly.
Solution Approach 2:
The patent extracts the information writing function from the central chip surface area and relocates it to the peripheral region. This separation allows the central area to maintain its original flatness and surface properties, while the peripheral area accommodates the information writing process without compromising thermal performance.
2Loss of information
If information is written on the semiconductor chip surface, then identification capability is improved, but thermally conductive material spreading uniformity deteriorates
Solution Approach 1:
The patent segments the chip surface into distinct functional zones, placing information writing in the peripheral region and thermally conductive material application in the central region. This spatial segmentation prevents the information writing process from creating wettability variations that would disrupt uniform material spreading.
Solution Approach 2:
The information writing function is extracted from the central active area and relocated to the periphery, eliminating the harmful interaction between writing processes and thermally conductive material application, thereby ensuring uniform material distribution.
3Manufacturing precision
If a flat surface is maintained on the semiconductor chip, then thermally conductive material spreading is improved, but information writing capability deteriorates
Solution Approach 1:
The patent applies segmentation by designating the peripheral region for information writing and the central region for maintaining flatness and thermal material application. This allows both requirements to be satisfied simultaneously in different spatial zones.
Solution Approach 2:
The patent resolves the conflict by utilizing the spatial dimension of the chip surface, allocating different functional zones radially (periphery vs. center). This dimensional allocation allows information writing and flat surface maintenance to coexist without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved heat transfer and easier maintenance by ensuring the thermally conductive material spreads evenly, maintaining high cooling performance and facilitating repair by keeping the chip surface flat and free of information markings.
Implementation Method 1
A thermally conductive material having fluidity is disposed between a surface of the semiconductor chip and the radiator
Implementation Method 2
the thermally conductive material does not spread evenly over the surface of the semiconductor chip
Implementation Method 3
areas differing in wettability (contact angle) between the surfaces of the liquid metal and semiconductor chip are formed
Data Source
AI summary
Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material having fluidity is disposed between the upper surface of the semiconductor chip and a radiator. Therefore, the semiconductor chip provides high cooling performance.