Stiffener Ring Adhesive Layout for Semiconductor Warpage Control
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Solution Overview
Problem
The challenge of suppressing warpage deformation in semiconductor devices, particularly in larger wiring substrates, arises due to increased stress from temperature cycles, which conventional adhesive methods for stiffener rings on these substrates are inadequate in addressing efficiently.
Innovation Solution
A semiconductor device design featuring a stiffener ring fixed onto a wiring substrate via a plurality of separated adhesive layers, strategically positioned at specific overlapping regions to enhance adhesive strength while minimizing adhesive usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a continuous adhesive layer is arranged all around the stiffener ring, then adhesive strength is improved, but adhesive usage amount increases
Solution Approach 1:
The continuous adhesive layer is divided into multiple discrete adhesive layers arranged at specific positions around the stiffener ring. Each adhesive layer is positioned at locations where it can effectively suppress warpage deformation, while the gaps between adhesive layers reduce overall adhesive consumption. This segmentation maintains necessary adhesive strength at critical locations while reducing total adhesive usage.
Solution Approach 2:
Adhesive layers are strategically positioned at specific locations around the stiffener ring rather than being uniformly distributed. The adhesive layers are arranged at positions corresponding to the center line and diagonal line of the wiring substrate, where they can most effectively counteract warpage deformation. This localized placement ensures adhesive strength is concentrated where needed while minimizing adhesive usage in less critical areas.
2Loss of substance
If adhesive layers are reduced to minimize material usage, then adhesive usage amount is improved, but adhesive strength deteriorates
Solution Approach 1:
The adhesive layers are pre-positioned at specific locations on the wiring substrate before the stiffener ring is attached. This preliminary placement ensures that the adhesive layers are exactly where needed to suppress warpage deformation, maximizing the effectiveness of each adhesive layer and maintaining sufficient adhesive strength with reduced overall adhesive usage.
Solution Approach 2:
The adhesive layers are arranged in a two-dimensional pattern around the stiffener ring, positioned at specific radial and angular locations. This dimensional arrangement allows the adhesive strength to be distributed effectively around the perimeter, providing sufficient holding force with fewer layers than a continuous or uniformly distributed arrangement would require.
3Stability of the object's composition
If a stiffener ring is mounted on a large wiring substrate, then warpage suppression is improved, but manufacturing complexity increases
Solution Approach 1:
The adhesive application process is segmented into discrete steps, with adhesive layers applied at specific positions around the stiffener ring. This segmentation simplifies the manufacturing process by allowing automated pick-and-place or dispensing equipment to apply adhesive at predetermined locations, reducing the complexity compared to applying a continuous adhesive layer around the entire perimeter.
Solution Approach 2:
The adhesive layers are positioned at specific locations corresponding to the center line and diagonal line of the wiring substrate. This localized placement simplifies manufacturing by reducing the number of adhesive application points and making the process more controllable and easier to automate, while still providing effective warpage suppression at the most critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses warpage deformation in the wiring substrate while reducing the amount of adhesive required, thereby controlling manufacturing costs and preventing adhesive accumulation, thus enhancing the semiconductor device's performance.
Implementation Method 1
a stiffener ring fixed onto the upper surface of the wiring substrate via a plurality of adhesive layers separated from each other
Data Source
AI summary
A semiconductor device includes a wiring substrate having an upper surface, a semiconductor chip mounted on the wiring substrate, and a stiffener ring fixed onto the wiring substrate via a plurality of adhesive layers. The upper surface is a quadrangular shape, and first and second center lines and first and second diagonal lines can be drawn. The stiffener ring has four extension portions and four corner portions. Adhesive layers include first, second, third and fourth adhesive layers that respectively overlap with the four extension portions and that are arranged at a portion overlapping with one of the first center line and the second center line. Also the adhesive layers include fifth, sixth, seventh, and eighth adhesive layers that respectively overlap with the four corner portions and that are arranged at a portion overlapping with one of the first diagonal line and the second diagonal line.