Stiffener Ring Adhesive Structure for Semiconductor Warpage
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Solution Overview
Problem
Semiconductor devices face warpage issues due to thermal coefficient differences in structural layers, which are exacerbated by delamination of stiffener rings during thermal cycles, affecting their reliability.
Innovation Solution
Incorporating an adhesive layer with a thicker portion between the ring structure and the substrate, configured as a stress buffer, to increase adhesion and contact area, and extending it to the inner and outer edges of the ring structure to enhance adhesion and reduce stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If stiffener rings are incorporated into the semiconductor device to control warpage, then warpage is reduced, but delamination occurs during thermal cycles
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness, featuring a thicker portion positioned between the stiffener ring and substrate. This localized thickness variation creates a stress buffer zone that specifically addresses the delamination problem at the ring-substrate interface while preserving the warpage control function of the stiffener ring.
Solution Approach 2:
The thicker adhesive layer is strategically positioned to act as a pre-established stress buffer that cushions thermal expansion stresses before they can cause delamination. This preventive cushioning approach addresses the thermal cycle-induced delamination issue before it occurs during device operation.
2Reliability
If adhesive layer thickness is increased to reduce delamination, then adhesion is improved, but device complexity increases
Solution Approach 1:
Rather than uniformly increasing adhesive layer thickness throughout the device, the invention applies the thicker adhesive portion only in the specific region between the stiffener ring and substrate where delamination risk is highest. This localized approach improves adhesion where needed while minimizing the overall complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces delamination and stress concentration, enhancing the reliability and durability of semiconductor devices by increasing the adhesion between the ring structure and the substrate, thus alleviating warpage and improving robustness.
Implementation Method 1
an adhesive layer with a thicker portion between the ring structure and the substrate and configured as a stress buffer
Implementation Method 2
extending it to the inner and outer edges of the ring structure to enhance adhesion
Data Source
AI summary
A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.