Stiffener Ring with Reinforcement Rib for Semiconductor Package Warpage Control
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Solution Overview
Problem
The challenge in semiconductor packaging is to effectively dissipate heat generated by integrated circuit chips without compromising the structural rigidity of the package, particularly as die power consumption, size, and heat density increase, while also controlling warpage due to thermal expansion differences among package components.
Innovation Solution
A semiconductor package design featuring a stiffener ring with a reinforcement rib on the package substrate, which forms compartments for individual chip packages, allowing for improved heat dissipation through direct thermal contact with the heat sink and maintaining structural integrity by controlling warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal lid is used to dissipate heat from the chip, then heat dissipation is improved, but the structural rigidity of the package deteriorates
Solution Approach 1:
The package structure is segmented into multiple functional layers: a flexible circuit board base layer, a rigid stiffener ring layer, and a metal lid layer. This segmentation allows each layer to perform its specialized function - the stiffener ring provides structural support while the metal lid handles heat dissipation, resolving the contradiction between rigidity and thermal management.
Solution Approach 2:
The package employs composite construction combining different materials with complementary properties: the stiffener ring uses rigid materials (such as ceramic or metal) to provide structural strength, while the metal lid uses thermally conductive materials for heat dissipation. This composite approach allows simultaneous optimization of both structural rigidity and thermal performance.
2Power
If the die size and power consumption increase to improve performance, then processing capability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation approach transitions from two-dimensional conduction through the chip to three-dimensional heat management. The stiffener ring structure creates vertical heat pathways and expands the thermal management surface area, allowing heat from high-power density chips to be efficiently conducted through multiple pathways to the metal lid and external heat sinks.
3Stability of the object's composition
If stiffener rings are added to control warpage, then structural integrity is improved, but device complexity increases
Solution Approach 1:
The stiffener ring is merged with the circuit board assembly process, serving dual purposes as both a structural support element and an integral part of the package interconnection system. This merging reduces overall complexity by combining multiple functions into a single integrated component rather than adding separate warpage control elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency while maintaining structural rigidity, effectively managing thermal stresses and ensuring reliable performance of semiconductor devices.
Implementation Method 1
The heat from the chip is transferred to the metal lid via a thermally conductive chip/lid interface. The heat is then transferred from the lid to the ambient atmosphere via convection or to a heat sink mounted on the lid.
Implementation Method 2
The heat is then transferred from the lid to the ambient atmosphere via convection or to a heat sink mounted on the lid.
Implementation Method 3
warpage that occurs due to differences in the thermal coefficient of expansion (TCE) of the various package components or materials needs to be controlled
Data Source
AI summary
A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.