Semiconductor Package Stiffener Transfer for Warpage and Heat Dissipation
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Solution Overview
Problem
Highly integrated semiconductor packages face challenges with warpage and heat dissipation due to thermal expansion rate differences and internal heat generation, necessitating improved methods for regulating heat and preventing warpage.
Innovation Solution
A method involving the use of a stiffener and a plate structure, where a semiconductor chip is mounted on a package substrate, and a stiffener is formed on a plate, bonded to the substrate, and then the plate is removed, leaving the stiffener to enhance warpage resistance and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a highly integrated semiconductor package is used, then functionalization and miniaturization are improved, but warpage occurs due to thermal expansion rate difference and heat generation
Solution Approach 1:
The patent introduces a stiffener as an intermediary component between the semiconductor chip and the package substrate. This stiffener serves as a mediator that counteracts the warpage forces generated by thermal expansion rate differences and internal heat generation, thereby maintaining package stability while enabling high integration and miniaturization.
Solution Approach 2:
The patent modifies the mechanical and thermal parameters of the package structure by incorporating a stiffener with specific material properties (higher modulus of elasticity and thermal conductivity). This parameter change enables the package to withstand thermal stresses and maintain flatness during operation, resolving the warpage issue while preserving functionalization benefits.
2Stability of the object's composition
If a stiffener is added to prevent warpage, then warpage resistance is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent changes the thermal conductivity parameter of the stiffener material to be higher than that of the semiconductor chip. This parameter change transforms the stiffener from a potential heat barrier into an effective heat conduction path, enabling it to simultaneously provide warpage resistance and enhance heat dissipation capability.
Solution Approach 2:
The stiffener is designed to perform multiple functions simultaneously: structural support for warpage prevention and thermal conduction for heat dissipation. This multi-functionality resolves the contradiction by making the same component beneficial for both mechanical stability and thermal management.
3Loss of energy
If a heat slug is used for heat regulation, then heat dissipation is improved, but warpage prevention effectiveness deteriorates compared to stiffener
Solution Approach 1:
The stiffener is designed to perform multiple functions simultaneously: structural support for warpage prevention and thermal conduction for heat dissipation. This multi-functionality resolves the contradiction by making the same component beneficial for both mechanical stability and thermal management.
Solution Approach 2:
The patent employs a composite structure where the stiffener material combines high mechanical strength (for warpage resistance) with high thermal conductivity (for heat dissipation). This composite approach allows the single component to outperform separate heat slug and stiffener configurations by integrating both functionalities.
4Loss of energy
If natural convection heat regulation is used with heat slug, then heat dissipation is improved, but forced convection with stiffener provides superior heat dissipation
Solution Approach 1:
The patent changes the thermal conductivity parameter of the stiffener material to be higher than that of the semiconductor chip, creating an optimized thermal conduction path that works effectively with forced convection systems. This parameter optimization enables superior heat dissipation performance while maintaining relatively simple package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved warpage resistance and enhanced heat dissipation characteristics in semiconductor packages by leveraging the higher thermal conductivity of the stiffener and the structural support of the plate, effectively suppressing package deformation and facilitating heat transfer.
Implementation Method 1
a thermal conductivity of the plate is less than a thermal conductivity of the stiffener
Implementation Method 2
forming a first adhesive layer on the first semiconductor chip, disposing the stiffener and the plate on the package substrate... bonding the first surface of the plate to the first adhesive layer
Data Source
AI summary
A method of manufacturing a semiconductor package having improved warpage resistance and an improved heat dissipation characteristic. The method of manufacturing the semiconductor package includes mounting a first semiconductor chip on a first surface of the package substrate, forming a stiffener on a first surface of a plate, forming a first adhesive layer on the first semiconductor chip, disposing the stiffener and the plate on the package substrate such that the first surface of the plate faces the first surface of the package substrate and the stiffener is connected to the first surface of the package substrate, bonding the first surface of the plate to the first adhesive layer, and removing the plate. After removing the plate, the stiffener remains connected to the first surface of the package substrate.