Stiffening Ring Adhesive Interface With Openings for Stronger Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face adhesion issues between substrates and stiffening rings due to insufficient adhesive strength, particularly when the stiffening ring is made of metal or metal alloys like stainless steel, which limits the selection of adhesives that can be used, and increasing the size of the device is undesirable.
Innovation Solution
The design incorporates features such as openings or protrusions on the surface of the substrate or stiffening ring that increase the contact area with the adhesive, allowing for improved adhesion without enlarging the device, using materials like stainless steel and employing adhesives with lower Shore D hardness, such as polydimethylsiloxane, to enhance bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate and stiffening ring are made wider to increase adhesion area, then the adhesive contact area increases improving adhesion, but the device size increases which is undesired
Solution Approach 1:
The patent transitions from increasing adhesion area in the horizontal plane (which would enlarge device size) to increasing adhesion area in the vertical dimension by creating openings and recesses in the stiffening ring. This allows the adhesive to contact multiple surfaces including the bottom surface of the stiffening ring and the inner walls of openings, achieving greater adhesion without increasing the device's footprint.
Solution Approach 2:
The stiffening ring is designed with openings that create a porous or hollow structure. This allows the adhesive to penetrate into the openings and contact additional surface areas, effectively increasing the bonding interface without requiring a larger overall device size. The openings act as adhesive reservoirs that enhance the bonding between the substrate and stiffening ring.
2Strength
If a harder adhesive is used to improve bond strength, then adhesion between substrate and stiffening ring improves, but the selection of adhesive materials is limited
Solution Approach 1:
The patent changes the physical parameters of the adhesive, specifically using a softer adhesive with lower Shore D hardness (less than 90, and in some embodiments less than 80). This parameter change expands the range of suitable adhesive materials while the structural features (openings and recesses) compensate for the lower hardness by providing increased mechanical interlocking and contact area, thereby maintaining sufficient adhesion strength.
3Strength
If the adhesive thickness is increased to improve adhesion, then the adhesive can better accommodate surface irregularities, but the structural integrity and precision of the assembly deteriorates
Solution Approach 1:
The stiffening ring is pre-formed with openings and recesses before assembly. These features are built into the structure in advance, creating predetermined pathways and zones for adhesive placement. This preliminary action ensures that the adhesive is positioned optimally to maximize bonding while maintaining precise alignment and uniform thickness, preventing both delamination and manufacturing defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures sufficient adhesion between the substrate and the stiffening ring using a softer adhesive, expanding the range of adhesive options and maintaining the device's size, thereby improving mechanical integrity and reducing the risk of delamination.
Implementation Method 1
an adhesive contacting the feature and the proximal surfaces of the structure and the substrate
Data Source
AI summary
An electronic device includes a substrate, an electronic component, a structure, and an adhesive. The substrate has a proximal surface. The electronic component includes at least one die, wherein the electronic component is attached to the substrate. The structure has a proximal surface adjacent to proximal surface of the substrate. A feature extends from the proximal surface of the structure or the substrate, and the adhesive contacts the feature and the proximal surfaces of the structure and the substrate. In another aspect, a process of forming the electronic device can include applying the adhesive, placing the substrate and structure adjacent to each other, wherein the adhesive contacts the feature and the proximal surfaces of the substrate and the substrate, and curing the adhesive.