Stilted SIP Interconnects for Dual-Side Cooling Clearance
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Solution Overview
Problem
Traditional SIP module designs face challenges in enabling top-side and dual-side cooling, as well as accommodating large surface mounted components in double-sided configurations, due to limitations in interconnect design and cooling capabilities.
Innovation Solution
The proposed SIP module incorporates stilted interconnects with dielectric sections and conductive structures that extend vertically, allowing for top-side and dual-side cooling while accommodating large surface mounted components in a double-sided configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional LGA or BGA interconnect designs are used, then bottom-side cooling is provided, but top-side cooling capability is lost and space for bottom-side components is limited
Solution Approach 1:
The patent transitions from planar interconnect designs to three-dimensional stilted interconnects that extend vertically from the substrate. This vertical dimension creates clearance space between the substrate and mounted components, enabling cooling structures to be positioned on both the top and bottom sides of the package without interference from interconnect elements.
Solution Approach 2:
The interconnect structure is segmented into multiple functional zones: the stilt portion providing vertical support and clearance, the base portion attached to the substrate, and the protruding contact portion for electrical connection. This segmentation allows each zone to independently fulfill its function while enabling dual-side cooling architecture.
2Device complexity
If conventional interconnect designs are used, then simple structure is maintained, but accommodation of large surface mounted components in double-sided configuration is difficult
Solution Approach 1:
By extending interconnects vertically in the Z-dimension rather than spreading them horizontally, the patent creates sufficient clearance space to accommodate large surface-mounted components on both sides of the substrate. The stilted structure lifts the electrical contact points away from the component mounting plane.
Solution Approach 2:
The stilted interconnect structure nests the electrical connection function within a three-dimensional form that provides mechanical clearance. The contact portion is nested within the vertical projection of the stilt structure, allowing components to be mounted on the substrate surface without interfering with the interconnect's electrical function.
3Ease of manufacture
If traditional laminate overmolded SIP modules are used, then manufacturing simplicity is maintained, but top-side cooling for wire-bond dies is difficult to implement
Solution Approach 1:
The stilted interconnect design creates vertical clearance that allows cooling structures to be positioned adjacent to wire-bond dies on the top side of the package. The elevated contact portions do not obstruct the placement of thermal management elements near heat-generating components.
Solution Approach 2:
The stilted interconnect structure acts as an intermediary element that separates the electrical connection function from the thermal management function. By positioning the contact portions vertically above the substrate rather than in direct contact with the component mounting surface, it enables independent optimization of both electrical and thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances cooling capabilities and accommodates large components, improving the thermal management and electrical performance of SIP modules, particularly in high-power and high-frequency applications.
Implementation Method 1
at least one bottom stilted interconnect connected to and protruding from the bottom surface... The at least one first electrical component is electrically and/or thermally coupled to the at least one bottom stilted interconnect
Implementation Method 2
Each conductor extends vertically through a corresponding one of the dielectric sections, and the metal plates alternate with the conductors in a vertical direction
Data Source
AI summary
The present disclosure relates to a system in package (SIP) with stilted interconnects to enable top-side and/or dual-side cooling and to accommodate large surface mounted components in a double-sided configuration. The SIP includes a laminate substrate, at least one electrical component formed at a bottom surface of the laminate substrate, and at least one bottom stilted interconnect connected to and protruding from the bottom surface of the laminate substrate. Herein, the at least one bottom stilted interconnect includes a number of dielectric sections and a conductive structure extending vertically through the dielectric sections. The conductive structure includes a number of conductors and a number of metal plates. Each conductor extends vertically through a corresponding dielectric section, and the metal plates alternate with the conductors in a vertical direction. The at least one first electrical component is electrically and/or thermally coupled to the at least one bottom stilted interconnect.