Stimulator Lead Fabrication Without Temporary Carrier Etching
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Solution Overview
Problem
Existing methods for manufacturing stimulator leads with electrodes face challenges such as the need for temporary carriers, which require etching processes that are time-consuming and pose safety hazards, and result in increased manufacturing costs and operator oversight.
Innovation Solution
A method involving forming an array of electrodes in a predetermined arrangement within a carrier mold, using a biocompatible material to create a carrier that does not completely cover the electrodes, and attaching conductors to the back surfaces for secure positioning and connection, eliminating the need for temporary carriers and associated etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If temporary carriers are used in existing manufacturing methods, then electrode positioning is achieved, but manufacturing time increases and safety hazards arise from etching processes
Solution Approach 1:
The patent removes the temporary carrier component entirely from the manufacturing process. Instead of using a carrier that must be etched away, the invention directly forms the electrode array structure without this intermediate step, thereby eliminating the time-consuming etching process while maintaining electrode positioning precision through alternative molding techniques
Solution Approach 2:
The patent incorporates electrode positioning features directly into the molding process itself. The mold includes predetermined cavities and positioning structures that guide electrode placement before the final product is formed, eliminating the need for separate carrier installation and etching steps while ensuring precise electrode positioning
2Manufacturing precision
If temporary carriers with etching processes are used, then electrode positioning is achieved, but manufacturing costs increase and safety hazards arise
Solution Approach 1:
The patent eliminates the etching process entirely by removing the temporary carrier component. The electrode array is formed directly through molding techniques that do not require hazardous chemical etching, thereby eliminating safety hazards associated with chemical exposure while maintaining positioning precision through physical mold constraints
Solution Approach 2:
The patent converts the potentially harmful etching process into a beneficial direct molding process. Instead of using hazardous chemicals to remove carrier material, the invention uses a molding process that directly forms the electrode array structure, turning a harmful process into a safe and efficient one while maintaining the same positioning function
3Manufacturing precision
If temporary carriers are used, then electrode positioning is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the electrode array formation with the carrier structure itself. Instead of separate temporary carriers and electrode arrays, the invention integrates these into a single molded component where the carrier structure and electrode array are formed together in one manufacturing step, thereby reducing process complexity while maintaining positioning precision
Solution Approach 2:
The patent incorporates electrode positioning features directly into the molding process. The mold includes predetermined cavities and positioning structures that guide electrode placement before the final product is formed, eliminating the need for separate carrier installation and etching steps, thereby reducing manufacturing complexity while ensuring precise positioning
Data Source
AI summary
A lead for a stimulation device can include an array of electrodes with each electrode having a front surface and a back surface; a plurality of conductors; a carrier formed around the array of electrodes; and a biocompatible material that may be disposed over and/or joined with the carrier and the back surfaces of the electrodes. A conductor is attached to the back surface of each electrode. The carrier can be formed around the array of electrodes, but does not completely cover the front surface or back surface of the electrodes.