Free-Piston Stirling Cooler Integration for Semiconductor Test Cooling

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Solution Overview

Problem

Existing semiconductor temperature control systems are cumbersome and complex, requiring remote equipment and lengthy hose connections, which increases the risk of refrigerant leakage and limits the ability to achieve low temperatures near the device under test.

Innovation Solution

A portable cooling system utilizing a free piston Stirling cooler eliminates the need for remote chillers, compressors, and hoses by integrating the cooling system directly near the semiconductor device, using a free piston Stirling cooler with an electrical power line and air supply line, and incorporating an adaptive thermal clutch for controlled heating and cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional coolant-based cooling systems are used, then temperature control capability is provided, but system complexity and equipment size increase due to remote compressors, evaporators, and hose connections

Engineering Contradiction:
Improvetemperature control capabilityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the complex remote cooling equipment (compressors, evaporators, chillers) and hose connections from the system. By using a free-piston Stirling cooler that can be directly integrated into the probe, the system removes the need for separate remote cooling components and coolant routing infrastructure, thereby reducing overall system complexity while maintaining temperature control capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the cooling function directly into the probe assembly by integrating the free-piston Stirling cooler within or alongside the measurement probe. This consolidation eliminates the need for separate remote cooling equipment and extensive hose connections, combining multiple functions (measurement and cooling) into a single integrated unit, thus reducing system complexity.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If remote cooling equipment with hose connections is used, then cooling function is provided, but risk of refrigerant leakage increases

Engineering Contradiction:
Improvecooling functionVSAvoidrefrigerant leakage risk
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent extracts and removes the refrigerant circulation system including hoses, connections, and remote coolant equipment from the design. By using a free-piston Stirling cooler that operates without refrigerant loops, the system eliminates the sources of potential leakage, thereby improving reliability while maintaining the cooling function.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If traditional cooling systems with extensive hose routing are used, then cooling capability is provided, but system portability and proximity to device under test are reduced

Engineering Contradiction:
Improvecooling capabilityVSAvoidsystem portability
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent merges the cooling mechanism directly into the portable probe unit by integrating the free-piston Stirling cooler within the probe assembly. This integration allows the entire cooling system to be contained within or near the probe, eliminating the need for external remote equipment and extensive hose routing, thereby significantly improving portability and enabling close proximity operation to the device under test.

Inventive Principle:
Principle #5Merging (Combining)

4Temperature

If thermoelectric coolers are used to achieve temperatures below -40°C, then sub-zero temperature capability is provided, but device complexity increases

Engineering Contradiction:
Improvesub-zero temperature capabilityVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical cooling systems (thermoelectric coolers, refrigerant-based systems) with a free-piston Stirling cooler that uses mechanical oscillation and gas compression/expansion cycles. The free-piston mechanism naturally achieves the required sub-zero temperatures through its thermodynamic cycle without requiring additional complex control systems or multiple cooling stages, thereby reducing device complexity while maintaining sub-zero temperature capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves extremely low temperatures below −100°C efficiently and safely, reducing the risk of leakage and enabling faster startup, while allowing for compact, direct proximity to the semiconductor device, thus addressing industry needs for low-temperature testing.

Implementation Method 1

portable cooling system utilizing a free piston Stirling cooler

Methodology Applied
Scientific EffectStirling cycle: Stirling Cycle

Implementation Method 2

thermal adapter system that incorporates key features specifically for semiconductor test applications

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10126359B2Free piston stirling cooler temperature control system for semiconductor test
Publication Date: 2018.11.13 LTI HOLDINGS INC
  • US10126359B2 patent drawing
  • US10126359B2 patent drawing
  • US10126359B2 patent drawing

AI summary

A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.