Stitched Image Sensor Dies Using Virtual Unit Tiles

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Solution Overview

Problem

Traditional methods for designing reticle sets and partitioning IP circuitry blocks for stitched image sensors are restrictive, limiting the dimensions of image sensor dies and pixel resolutions, especially for ultra-high resolutions, due to constraints in manufacturing processes that require integer multiples of tile dimensions.

Innovation Solution

The use of virtual unit tiles to size physical tiles in the reticle set, allowing for non-integer multiples and more flexible dimensions, which enables more efficient allocation of reticle space and improved pixel resolution capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional manufacturing constraints requiring integer multiples of tile dimensions are applied, then manufacturing process simplicity is maintained, but image sensor die dimensions and pixel resolutions are limited

Engineering Contradiction:
Improvetile dimension precisionVSAvoidpixel resolution flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent introduces a virtual tile as an intermediary design tool that allows non-integer dimension ratios. The virtual tile serves as a mediator between the manufacturing constraints and the desired flexible pixel resolutions, enabling designers to specify arbitrary tile dimensions in the design phase while the manufacturing process still operates with integer-based physical tiles.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the dimensional parameters from strict integer multiples to rational number ratios. By allowing tile dimensions to be defined by ratios of integers rather than strict integer multiples, the system achieves finer granularity in dimension control while maintaining compatibility with manufacturing processes that operate on discrete units.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If tile dimensions are constrained to integer multiples, then reticle set design is simplified, but reticle space utilization efficiency decreases

Engineering Contradiction:
Improvereticle set design complexityVSAvoidreticle space utilization
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent changes the dimensional parameter system from integer multiples to rational number ratios. This allows tile dimensions to be optimized for maximum reticle space utilization while maintaining a relatively simple design process. The rational number system provides flexibility in dimension ratios without significantly increasing design complexity.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If physical tiles are sized using integer multiples of the smallest tile, then manufacturing alignment is simplified, but pixel tile size and resolution are restricted

Engineering Contradiction:
Improvemanufacturing alignment easeVSAvoidpixel tile length
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The virtual tile acts as an intermediary that decouples the alignment requirements from the final pixel tile dimensions. The virtual tile with its rational number ratios allows precise dimension specification, while the manufacturing process uses the virtual tile as a reference for positioning physical tiles, maintaining alignment simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the design process into virtual design phase and physical manufacturing phase. In the virtual phase, tiles can be any rational dimension ratio for optimal pixel resolution. In the manufacturing phase, these virtual dimensions are translated into physical tile placements that maintain alignment through the virtual coordinate system.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11721710B2Stitched integrated circuit dies
Publication Date: 2023.08.08 SEMICON COMPONENTS IND LLC
  • US11721710B2 patent drawing
  • US11721710B2 patent drawing
  • US11721710B2 patent drawing

AI summary

An image sensor may be implemented using a stitched image sensor die. The stitched image sensor die may be formed from a step and repeat exposure process using a set of physical tiles in a reticle set. The physical tiles may include a center tile forming pixel circuitry on the image sensor die and peripheral tiles forming non-pixel circuitry on the image sensor die. Each of the physical tiles may be sized based on an integer multiple of a virtual unit tile. As such, the physical tiles may have dimensions that are not required to be an integer multiple of the smallest physical tile. The step and repeat exposure process may use the unit lengths of the virtual unit tile to properly position the die relative to the processing tools.