Stitching Via Electromagnetic Bandgap Structure for Multi-Layer PCB Noise
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Solution Overview
Problem
Existing electromagnetic bandgap structures, such as the mushroom type, face limitations in blocking conductive noise across various frequency bands and are difficult to apply to multi-layered printed circuit boards due to restricted inductance and capacitance values, making it challenging to effectively filter signals in complex electronic systems.
Innovation Solution
The introduction of a stitching via structure in the electromagnetic bandgap structure, which includes conductive plates between two conductive layers and stitching vias that connect these plates, allowing for adjustable inductance and capacitance values, enabling broader frequency band blocking without the need for bypass or decoupling capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a mushroom type electromagnetic bandgap structure is used, then a certain frequency band can be blocked, but the inductance and capacitance values are restricted and cannot be adjusted for broader frequency bands
Solution Approach 1:
The electromagnetic bandgap structure is divided into multiple unit structures arranged in an array. Each unit structure contains conductive plates, stitching vias, and connection patterns that can be independently configured. This segmentation allows the overall structure to achieve broader frequency band blocking by combining multiple units with different inductance and capacitance characteristics, while maintaining manageable complexity through modular design.
Solution Approach 2:
The invention extends the traditional planar electromagnetic bandgap structure into the vertical dimension by introducing stitching vias that connect conductive plates across multiple layers. This three-dimensional configuration enables additional degrees of freedom in adjusting inductance and capacitance values, allowing broader frequency band blocking without proportionally increasing planar complexity.
2Object-affected harmful factors
If traditional bypass capacitor or decoupling capacitor methods are used, then conductive noise can be reduced, but they are inadequate for high frequency bands and complex wiring boards
Solution Approach 1:
The invention replaces traditional capacitor-based noise filtering mechanisms with an electromagnetic bandgap structure based on distributed inductance and capacitance elements. This substitution creates a frequency-selective filtering effect that is inherently more suitable for high-frequency applications and complex wiring boards, as it provides broadband noise reduction without the limitations of discrete capacitor approaches.
3Object-affected harmful factors
If the electromagnetic bandgap structure is applied to multi-layered PCBs, then noise blocking can be improved, but the manufacturing process becomes more complex
Solution Approach 1:
The invention integrates the electromagnetic bandgap structure with existing multi-layered PCB construction by incorporating conductive plates, stitching vias, and connection patterns into the standard layer stack-up. This merging approach allows noise blocking functionality to be achieved within the conventional PCB manufacturing process, avoiding the need for separate fabrication steps while improving conductive noise blocking performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced flexibility in designing bandgap frequencies, effectively blocking conductive noise across a wider range of frequencies, making it suitable for various applications, including multi-layered printed circuit boards and high-frequency networks.
Implementation Method 1
an electromagnetic bandgap structure having a predetermined structural shape in a printed circuit board to block a signal of a predetermined frequency band
Implementation Method 2
adjustable inductance and capacitance values, enabling broader frequency band blocking
Data Source
AI summary
An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.