Direct Imaging Stitchless Electronic Patterning
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Solution Overview
Problem
Current direct imaging systems for high-resolution electronic patterning face challenges in accurately configuring direct writing data to avoid stitching errors between adjacent scans, particularly due to inaccuracies and distortions in the surface configuration, leading to incomplete exposure of electrical circuit features.
Innovation Solution
The system configures direct writing data to ensure each object is written within a single scan, with scan seams located between objects rather than over them, and modifies CAD data to account for surface inaccuracies and distortions through optical imaging, allowing for side-by-side arrangement of multiple layers within each scan to prevent stitching issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple scans are used to cover the entire surface, then the coverage area is improved, but stitching errors occur between adjacent scans
Solution Approach 1:
The system performs optical imaging of the surface before direct writing to detect inaccuracies and distortions in advance. This preliminary measurement allows the system to pre-calculate and pre-position scan seams between objects, preventing stitching errors before they occur during the actual patterning process.
Solution Approach 2:
The patent introduces an intermediary processing step that modifies CAD data by incorporating measured surface distortion information. This intermediary data layer acts as a mediator between the ideal design pattern and the actual physical surface, allowing scan seams to be strategically positioned between objects while compensating for surface irregularities.
2Manufacturing precision
If scan seams are positioned between objects, then stitching errors are eliminated, but the scanning complexity increases
Solution Approach 1:
The system performs self-configuration by automatically detecting surface distortions through optical imaging and autonomously calculating the optimal scan paths and seam positions. This self-service capability eliminates the need for manual scanning configuration, reducing operational complexity despite the sophisticated positioning requirements.
Solution Approach 2:
The patent dynamically changes scanning parameters including scan width, scan speed, and seam positioning based on the measured surface topography. By adapting these parameters to the actual surface conditions, the system achieves high pattern accuracy without requiring complex fixed scanning configurations.
3Measurement precision
If optical imaging is performed to detect surface inaccuracies, then the positioning accuracy is improved, but the process time increases
Solution Approach 1:
The system performs optical imaging at a lower resolution or with reduced scanning coverage than would be required for complete surface characterization, focusing only on critical areas that affect pattern placement. This partial measurement approach provides sufficient accuracy for positioning scan seams while significantly reducing the time penalty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that no object is written across multiple scans, thereby eliminating stitching errors and achieving precise, high-resolution patterning without the need for complex mitigation techniques, enhancing the accuracy and completeness of electronic patterning.
Implementation Method 1
The system creates electrical circuit features on a substrate by exposing photoresist on a surface of the substrate to a laser beam
Data Source
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Figure 1B
Figure 2A
AI summary
A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.