Stochastic Variation Estimation in Lithography
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Solution Overview
Problem
Current lithography processes face challenges in accurately predicting and controlling stochastic variations in resist processing, such as feature edge/width roughness, due to limitations in modeling dose sensitivity and quencher effects, which affect the precision of pattern transfer in semiconductor manufacturing.
Innovation Solution
A method involving a calibrated stochastic model that incorporates resist process dose sensitivity and quencher parameters to predict stochastic variables like line edge roughness, using a hardware computer to design or modify patterning process parameters, and calibrating models with measured data to improve accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional lithography modeling is used to predict pattern transfer, then the process is simpler and faster, but the prediction accuracy of stochastic variations such as line edge roughness is insufficient
Solution Approach 1:
The patent segments the stochastic variation prediction into multiple independent components: dose sensitivity prediction, quencher effect prediction, and line edge roughness prediction. Each component is modeled separately using specific equations (Eq. 1 for dose sensitivity, Eq. 2 for quencher effects, Eq. 3 for LER), allowing the complex prediction task to be divided into manageable parts that can be computed efficiently and calibrated independently with experimental data.
2Manufacturing precision
If resist process dose sensitivity and quencher effects are incorporated into the stochastic model, then the prediction accuracy of line edge roughness improves, but the computational complexity and calibration requirements increase
Solution Approach 1:
The patent implements feedback mechanisms through calibration procedures where model predictions are compared with experimental measurements. Eq. 1 includes a calibration factor CF_dose, Eq. 2 includes CF_quencher, and Eq. 3 includes CF_LER that are determined by fitting model predictions to measured data. This feedback loop allows the model to be continuously refined and adjusted to match actual process behavior, improving prediction accuracy while providing a systematic approach to calibration.
3Reliability
If a calibrated stochastic model is used to predict line edge roughness, then the control of patterning process precision is enhanced, but the time and resources required for model calibration increase
Solution Approach 1:
The patent performs preliminary calibration actions by establishing baseline calibration factors (CF_dose, CF_quencher, CF_LER) through initial experimental measurements. Once calibrated, the model can predict stochastic variations for new patterning conditions without requiring re-calibration, as the calibration factors capture the fundamental process characteristics. This preliminary calibration establishes a reliable foundation that can be reused across multiple predictions, reducing the time investment required for each subsequent prediction.
Data Source
AI summary
A method including: obtaining a resist process dose sensitivity value for a patterning process; applying the resist process dose sensitivity value to a stochastic model providing values of a stochastic variable as a function of resist process dose sensitivity to obtain a value of the stochastic variable; and designing or modifying a parameter of the patterning process based on the stochastic variable value.


