Stopper Metal Layer for Precise Substrate Recess Depth
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Solution Overview
Problem
Existing methods for manufacturing electronic component built-in substrates face challenges in efficiently eliminating level differences and preventing warping, particularly due to the need for precise alignment and machining of insulating spacers, which increases processing time and complexity, and can result in inaccuracies and thermal expansion issues.
Innovation Solution
A method involving a stopper metal layer is used to form a concave portion in the insulating layer, allowing for precise penetration processing to create a consistent depth for component mounting, which eliminates level differences and reduces warping by using identical materials for insulating layers to match thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an insulating spacer with an opening portion is prepared in advance by machining to eliminate level difference, then the level difference of the electronic component can be eliminated, but the number of man-hours in processes is increased and manufacturing complexity increases
Solution Approach 1:
A recess portion is formed in advance in the lower surface of the core substrate at the component mounting region. This preliminary action eliminates the need for post-mounting adjustments and reduces manual intervention, as the recess automatically positions the electronic component at the correct level without requiring pre-machined insulating spacers.
Solution Approach 2:
The insulating spacer is eliminated from the process. Instead of using a separate insulating spacer with a pre-machined opening portion, the recess portion is directly formed in the core substrate, removing the intermediate component and simplifying the manufacturing process.
2Manufacturing precision
If an insulating spacer is used to eliminate level difference, then the level difference can be reduced, but a warp of the substrate is generated due to thermal expansion differences
Solution Approach 1:
The recess portion is formed directly in the core substrate using the same material, ensuring homogeneous thermal expansion characteristics. By eliminating the insulating spacer made of different material, thermal expansion differences are minimized, preventing substrate warp while maintaining level difference elimination.
3Ease of manufacture
If penetration processing is performed on the insulating layer without a stopper, then the opening portion can be formed, but it is difficult to control the depth consistency of the concave portion
Solution Approach 1:
A stopper layer is introduced as an intermediary between the penetration processing tool and the core substrate. This stopper layer acts as a depth reference, ensuring consistent depth of the recess portion across all processing locations while allowing easy formation through penetration processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, improves accuracy, and reduces the risk of warping by ensuring consistent depth and alignment, while also allowing for the use of identical materials for the insulating layers to match thermal expansion coefficients, resulting in a more reliable and efficient electronic component built-in substrate.
Implementation Method 1
penetration-processing the portion of the first insulating layer, which corresponds to the component mounting region to form an opening portion, while using the stopper metal layer as a stopper
Data Source
AI summary
In a method of manufacturing an electronic component built-in substrate of the present invention, a mounted body including a first insulating layer, a stopper metal layer formed under the first insulating layer of a portion corresponding to a component mounting region and a second insulating layer formed on a lower surface of the first insulating layer and covering the stopper metal layer is prepared, and a concave portion is obtained by penetration-processing a portion of the first insulating layer, which corresponds to the component mounting region to form an opening portion, while using the stopper metal layer as a stopper. Also, the stopper metal layer in the concave portion is removed, then an electronic component is mounted on the concave portion, and then a third insulating layer is formed on the electronic component.