Storage Apparatus Volume Reduction via 3D Component Placement
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Solution Overview
Problem
Conventional storage apparatuses face limitations in reducing volume due to the fixed positioning of electronic components on the circuit board, leading to increased size and manufacturing costs, and are often non-repairable due to systematic packaging.
Innovation Solution
The storage apparatus features a circuit board with the control unit and first golden finger on opposite surfaces, a supporting component with a slit and receiving space to shorten the board's length, and an iron case with a hook for easy assembly, allowing for reduced volume, modularization, and repairability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are fixed on the circuit board in conventional storage apparatus, then the circuit board must have a certain area and length to support the components, but the apparent volume of the storage apparatus cannot be further reduced
Solution Approach 1:
The patent applies dimensionality change by moving the control unit from the same plane as the golden finger to the backside of the circuit board. This spatial reconfiguration allows the control unit to be positioned in a different dimension (z-axis), effectively reducing the length requirement of the circuit board in the planar direction while maintaining all necessary electrical connections through vertical routing.
2Ease of manufacture
If systematic package is used to construct electronic elements into integrated package, then the storage apparatus can be easily modularized and manufactured in mass, but the package structure cannot be repaired and would be simply discarded when one element fails
Solution Approach 1:
The patent applies segmentation by separating the control unit from the systematic package structure. Instead of enclosing all electronic elements in a single irreparable package, the control unit is positioned on the backside of the circuit board and can be independently accessed, removed, or replaced without affecting other components, thereby enabling repairability while maintaining modular manufacturing capabilities.
3Productivity
If systematic package structure is used, then manufacturing process can be simplified, but once an error occurs in the packaging process, it is difficult to get reworked and the yield directly impacts the manufacturing cost
Solution Approach 1:
By segmenting the control unit from the package structure and positioning it on the backside of the circuit board, the patent enables independent handling of the control unit during manufacturing. If packaging errors occur, the control unit can be accessed and reworked separately without requiring complete package disassembly, thereby improving rework capability and reducing the impact of packaging yield on overall manufacturing cost.
Data Source
AI summary
A storage apparatus including a circuit board, a first flash memory, a first golden finger, a control unit, and a supporting component is provided. The circuit board has a first surface and a second surface. The first flash memory is disposed on the circuit board. The first golden finger and the control unit are disposed on an end of the circuit board, in which the first golden finger is disposed on the first surface, and the control unit is disposed on the second surface, and the control unit is substantially on the backside of the first golden finger. The control unit is electrically connected with the first memory and the first golden finger. The supporting component is used for supporting the circuit board.