Storage Chassis Cooling Fan Arrangement for Heat Dissipation
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Solution Overview
Problem
High-density storage apparatuses with high-performance circuit components generate excessive heat, requiring more efficient cooling solutions than existing configurations, and previous cooling methods like regulating gratings are inadequate for effective heat dissipation.
Innovation Solution
The storage apparatus incorporates a chassis design with cooling fan units arranged side by side across the width, forming a pressure adjustment area to evenly distribute cooling air and enhance heat dissipation around densely packed, heat-generating circuit components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-density packaging of circuit components is implemented to increase data storage capacity and processing performance, then storage capacity and processing speed are improved, but heat generation increases significantly
Solution Approach 1:
The cooling system is segmented into multiple cooling fan units arranged side by side, each responsible for cooling specific circuit components. This segmentation allows distributed heat dissipation across different zones, preventing heat concentration in any single area while maintaining high-density component packaging.
2Device complexity
If conventional cooling configurations are used in high-density storage apparatus, then device simplicity is maintained, but cooling efficiency becomes insufficient
Solution Approach 1:
Different cooling fan units are positioned to face specific circuit components based on their heat generation characteristics. The cooling system provides localized cooling quality matched to the thermal profile of each component region, ensuring high cooling efficiency where needed while maintaining overall system simplicity.
3Reliability
If cooling fans are arranged to face circuit components directly, then cooling effectiveness is improved, but uniform pressure distribution of cooling air is difficult to achieve
Solution Approach 1:
The cooling fan units are arranged asymmetrically with respect to the circuit components, with fans positioned at different locations and orientations. This asymmetric arrangement, combined with the pressure adjustment area, creates balanced pressure distribution across the cooling zones while maintaining effective cooling of each component.
4Volume of moving object
If the storage apparatus is downsized to meet market demands, then device compactness is improved, but cooling efficiency of densely packed components deteriorates
Solution Approach 1:
The cooling fan units are arranged in a planar configuration side by side across the width of the storage apparatus, utilizing horizontal space efficiently. This dimensional arrangement allows multiple cooling sources to operate in parallel within a compact footprint, providing adequate cooling for high-density components without increasing the overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform cooling and efficient heat dissipation for high-density circuit components, maintaining performance while reducing the risk of overheating in high-density storage systems.
Implementation Method 1
a plurality of cooling fan units that generate cooling air for cooling a circuit component mounted on the circuit board of the circuit package
Implementation Method 2
a pressure adjustment area extending in the width direction of the chassis is formed between the at least some of the plurality of circuit packages and the plurality of cooling fan units that face each other
Data Source
AI summary
Storage apparatus configured to provide an external apparatus with logical storage area as data storage area, the storage apparatus having a physical storage medium configured to generate the logical storage area, and storage controller communicatively coupled to physical storage medium to control data input/output processing between the external apparatus and the logical storage area, wherein the storage controller includes circuit package including circuit board which implements predetermined function of storage controller and a circuit board case to accommodate the circuit board, plurality of cooling fan units that generate cooling air for cooling circuit component mounted on the circuit board of the circuit package, and a chassis having a structure for accommodating the circuit package and the cooling fan units, some of circuit packages are inserted to be accommodated in chassis from opening thereof and are arranged side by side across width direction of chassis.