Semiconductor Storage Cooling Layout for Capacitor-Blocked Hot Spots
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Solution Overview
Problem
Semiconductor storage devices face challenges in effectively dissipating heat, particularly for components located below capacitors, due to limited heat connection structures and air flow guidance within the device.
Innovation Solution
Incorporating a regulating plate that guides air flow inside the housing towards the gap between the capacitor and the substrate, enhancing air flow rates and heat dissipation by directing air flow through strategically inclined and positioned components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capacitor is mounted on the substrate, then electrical function is provided, but heat dissipation becomes difficult for components below the capacitor
Solution Approach 1:
The patent utilizes the vertical space dimension by positioning the regulating plate in the air flow direction above the capacitor. This allows air to flow through the gap between the capacitor and substrate, creating a three-dimensional heat dissipation path that does not increase planar device complexity while effectively cooling components below the capacitor.
Solution Approach 2:
The regulating plate serves as an intermediary component that redirects air flow toward the gap between the capacitor and substrate. This mediator structure guides the cooling air to the specific region needing heat dissipation without requiring direct modification of the capacitor or substrate, thus maintaining structural simplicity while improving thermal management.
2Temperature
If air flow is increased for heat dissipation, then cooling efficiency improves, but air flow guidance structure becomes more complex
Solution Approach 1:
The regulating plate is strategically positioned only in the region where air flow redirection is needed - above the capacitor and oriented to guide air toward the gap between the capacitor and substrate. This localized approach improves heat dissipation efficiency for specific hot spots without requiring complex air flow guidance structures throughout the entire device.
Solution Approach 2:
Instead of trying to cool components from below or through conventional heat sinks, the patent inverts the approach by using air flow from above the capacitor, directing it through the gap between the capacitor and substrate to reach components that would otherwise be difficult to cool. This inverted air flow path achieves effective cooling with minimal structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation for semiconductor memories located below capacitors by increasing air flow rates and efficiently guiding air within the device, thereby enhancing the overall heat dissipation properties of the semiconductor storage device.
Implementation Method 1
The first regulating plate guides at least a part of air, which flows inside the housing, toward a gap between the capacitor and the substrate
Data Source
AI summary
A semiconductor storage device includes a housing, a substrate, a first semiconductor component, a capacitor, and a first regulating plate. The substrate is accommodated in the housing. The first semiconductor component is mounted on the substrate. The capacitor on the substrate, the capacitor includes a portion that overlaps the first semiconductor component from a side opposite to the substrate when viewed in a first direction, which is a thickness direction of the substrate. The first regulating plate guides at least a part of air, which flows inside the housing, toward a gap between the capacitor and the substrate.