Storage Device With Adhesive Carrier Foil And Fixing Frame
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Solution Overview
Problem
Existing devices for transporting semiconductor components, such as gel packs, are expensive and require complex processes to reduce adhesive force for non-destructive removal, while also needing to prevent components from slipping or falling off during transport.
Innovation Solution
A storage device comprising a base carrier with surface structuring, a carrier foil with adhesive properties, and a fixing frame that secures the carrier foil to the base carrier, allowing for easy removal of components using vacuum pressure without leaving residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional gel packs are used to transport semiconductor components, then components are protected during transport, but the adhesive force becomes too strong requiring vacuum to reduce it, and the devices are expensive
Solution Approach 1:
The device is divided into separate functional layers: a base carrier with surface structuring, a carrier foil with adhesive properties, and a cover. This segmentation allows each layer to perform its specific function independently - the surface structuring provides mechanical interlocking, the adhesive foil provides controlled adhesion, and the cover provides protection, eliminating the need for complex vacuum processes
Solution Approach 2:
The invention uses inexpensive materials such as adhesive foils and simple plastic carriers instead of expensive gel packs. The carrier foil can be easily replaced between uses, making the system cost-effective for single-use or limited-use applications while maintaining reliable component protection
2Stability of the object's composition
If conventional gel packs are used, then components are secured, but adhesive force must be reduced by creating vacuum which wraps gel around filaments reducing contact area
Solution Approach 1:
The base carrier features localized surface structuring with specific geometric patterns (such as pyramids, cones, or grooves) that provide mechanical interlocking at specific locations. The adhesive carrier foil is applied over these structures, creating localized adhesive bonds that hold components securely during transport but can be easily broken when vacuum is applied for removal
Solution Approach 2:
The invention utilizes vacuum pressure applied through the cover to selectively reduce adhesive forces between the carrier foil and components. The vacuum causes the adhesive foil to detach from the component surfaces, allowing easy removal without damaging the components or requiring manual manipulation
3Reliability
If components are placed on carrier with adhesive, then components do not slip or fall off, but adhesive residues may adhere to components upon removal
Solution Approach 1:
The adhesive carrier foil is designed with specific material properties including low-residue adhesive formulations. When vacuum is applied to remove components, the adhesive foil cleanly detaches without leaving visible residues or contaminating the component surfaces, maintaining component purity and readiness for next processing steps
4Reliability
If expensive gel packs are used for transport, then component protection is ensured, but production costs increase
Solution Approach 1:
The invention changes the material parameters from expensive gel-based systems to inexpensive adhesive foils and plastic carriers. The adhesive foil uses controlled adhesive strength parameters that provide sufficient holding force during transport while allowing easy release. The surface structuring parameters on the base carrier are optimized to enhance mechanical interlocking without requiring expensive materials
Solution Approach 2:
The device combines multiple materials with complementary properties: a rigid base carrier material (such as plastic or metal) with surface structuring, an adhesive carrier foil material that provides controlled adhesion, and a protective cover material. This composite structure achieves reliable component protection at low cost by leveraging the strengths of each material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution provides an inexpensive, robust, and safe method for transporting semiconductor components by reducing adhesive force and preventing contact between components, while enabling non-destructive removal and minimizing production costs.
Implementation Method 1
a carrier foil, one main surface of which is fixable to the main surface of the base carrier comprising the surface structuring, and to the other main surface of which the components are fixable
Implementation Method 2
When lifting the semiconductors from the carrier, the adhesive force of the carrier material must be reduced to such an extent that semiconductor bars can be removed non-destructively using, for example, vacuum tweezers
Data Source
AI summary
In an embodiment a storage device includes a base carrier extending along a main surface having a surface structuring, a carrier foil including a first main surface and a second main surface, wherein the first main surface is fixable to or arrangeable on the main surface of the base carrier, and wherein the components are fixable to the second main surface and a fixing frame fixing the carrier foil, which is fixed or positioned to the main surface of the base carrier, to the base carrier and acting as a releasable clamp so that the carrier foil is clampable and securable in or to the base carrier.