Semiconductor Storage Device Pattern Regions for Address Recognition

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Solution Overview

Problem

Current semiconductor storage devices face challenges in efficiently connecting and addressing memory blocks and bit lines due to limitations in pattern formation and representation on the chip surface, which hinders precise physical analysis and data storage efficiency.

Innovation Solution

The semiconductor storage device employs pattern regions on the chip surface, represented by conductive pattern members or holes, arranged in a binary or ternary format to indicate address positions of memory blocks and bit lines, allowing for precise physical analysis and improved data storage efficiency through unique pattern configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional pattern formation methods are used on the chip surface, then the device structure is simple, but the address recognition precision and physical analysis capability are insufficient

Engineering Contradiction:
Improveaddress recognition precisionVSAvoidpattern formation complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The chip surface is divided into multiple pattern regions, with each region containing patterns that represent specific address information for memory blocks and bit lines. This segmentation allows precise physical analysis and address recognition by dividing the addressing function across multiple spatially distributed pattern regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a new dimension of pattern formation on the chip surface, using conductive pattern members or holes arranged in binary or ternary formats. This adds a spatial dimension for encoding address information, enabling more precise address recognition beyond conventional methods.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If more pattern regions are added to represent address positions, then the address recognition accuracy improves, but the manufacturing complexity increases

Engineering Contradiction:
Improveaddress position precisionVSAvoidpattern formation ease
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent employs binary or ternary parameter systems for pattern representation, where pattern members or holes encode address information through their presence, absence, or configuration. This parameter-based approach enables precise address positioning while maintaining manufacturability through standardized pattern formation processes.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If conventional addressing methods are used, then the device structure is simple, but the data storage efficiency is limited

Engineering Contradiction:
Improvedata storage efficiencyVSAvoidchip structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The pattern regions serve multiple functions: they provide physical analysis capabilities, encode address information for memory blocks and bit lines, and enable efficient data storage. This multi-functionality improves data storage efficiency by integrating addressing and storage functions into a unified structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11508432B2Semiconductor storage device including identifying patterns at positions corresponding to memory blocks
Publication Date: 2022.11.22 KIOXIA CORP
  • US11508432B2 patent drawing
  • US11508432B2 patent drawing
  • US11508432B2 patent drawing

AI summary

According to one or more embodiments, a semiconductor storage device includes a first chip and a second chip. The first chip includes a semiconductor substrate and a plurality of transistors on the semiconductor substrate. The second chip includes a memory cell array and a plurality of first patterns. The memory cell array is connected to the plurality of transistors of the first chip and includes a plurality of memory blocks arranged in a first direction. The plurality of first patterns are spaced from each other in the first direction. Each first pattern represents a different number and is at a position corresponding to one or more of the memory blocks.