Storage Element Assembly Heat Dissipation Structure
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Solution Overview
Problem
Portable electronic devices face challenges in efficiently dissipating heat, which affects the performance of electronic elements such as batteries, processors, and memories.
Innovation Solution
A storage element assembly is designed with two storage elements and a connecting piece that wraps around the storage elements, forming a bridging portion to increase the heat dissipation area, and includes a metal layer, wave-absorbing layer, and insulating layer for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If storage elements are densely arranged in portable electronic devices, then device integration is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The connecting piece extends in the vertical dimension with a bridging portion that protrudes from the first side toward the second side, creating a three-dimensional heat dissipation structure. This vertical extension allows heat to dissipate in multiple directions (sideways through wrapping portions and upward through the bridging portion), transforming the traditional planar heat dissipation approach into a spatial multi-directional system.
Solution Approach 2:
The connecting piece is constructed as a composite structure with a metal layer (for thermal conduction), a wave-absorbing layer (for electromagnetic interference absorption), and optionally an insulating layer. This multi-material composition enables simultaneous heat dissipation, EMI shielding, and electrical insulation functions within a single component, resolving the contradiction between integration and heat management.
2Area of stationary object
If storage elements are placed close together, then space utilization is improved, but signal interference increases
Solution Approach 1:
The wave-absorbing layer in the connecting piece acts as an intermediary between adjacent storage elements, absorbing electromagnetic waves and preventing signal interference. This intermediate material layer allows storage elements to be placed close together for space efficiency while the wave-absorbing property of the connecting piece material mitigates the harmful electromagnetic interference that would otherwise occur.
Solution Approach 2:
The connecting piece serves multiple functions simultaneously: it provides structural connection between storage elements, enables heat dissipation through its metal layer, shields against electromagnetic interference through the wave-absorbing layer, and provides electrical insulation through the insulating layer. This multi-functionality allows close placement of storage elements without compromising signal integrity.
3Temperature
If a connecting piece with multiple layers is used, then heat dissipation and EMI shielding are improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functional requirements (connection, heat dissipation, EMI shielding, insulation) into a single integrated connecting piece component. Instead of using separate components for each function, the metal layer, wave-absorbing layer, and insulating layer are combined in one piece that performs all functions simultaneously, thereby improving heat dissipation and EMI shielding without proportionally increasing device complexity.
Solution Approach 2:
The connecting piece is designed as a multi-functional component where the metal layer handles thermal conduction, the wave-absorbing layer handles EMI shielding, and the insulating layer handles electrical isolation. This universal design allows one component to replace multiple separate components, achieving improved heat dissipation and EMI protection while maintaining relatively simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The storage element assembly achieves effective heat dissipation, reducing temperature differences between storage elements and minimizing signal interference and noise, thereby improving the overall performance and reliability of electronic devices.
Implementation Method 1
the connecting piece comprises a metal layer and a wave-absorbing layer, the metal layer is superimposed on the wave-absorbing layer
Implementation Method 2
the connecting piece comprises a metal layer and a wave-absorbing layer, the metal layer is superimposed on the wave-absorbing layer
Implementation Method 3
the electronic device further includes a fan configured to generate an airflow, where the airflow passes through the connecting piece
Data Source
AI summary
A storage element assembly includes two storage elements and a connecting piece. Each storage element has a first side and a second side opposite to each other and a third side and a fourth side opposite to each other, the third side and the fourth side are connected between the first side and the second side, and the third sides of the storage elements are opposite to each other and spaced by a gap. The connecting piece has two wrapping portions and a bridging portion, each wrapping portion wraps the first side, the second side, and the fourth side of one of the storage elements, and the bridging portion is connected between the wrapping portions and covers the gap. The present invention further provides an electronic device with the storage element assembly.