Storage Module Backplane Vertical Vents Airflow Impedance
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Solution Overview
Problem
As information handling systems become more complex and performant, cooling their components becomes increasingly complex, with existing systems often inefficiently managing airflow, leading to higher component temperatures and reduced performance.
Innovation Solution
A modular chassis design with a compute module and storage module, featuring a backplane with vertical vent openings aligned with channels between divider walls, which directs airflow effectively through the system, minimizing impedance and enhancing airflow velocity between storage devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan generates airflow through the chassis to cool components, then cooling effectiveness improves, but airflow impedance increases and storage device dynamics performance deteriorates
Solution Approach 1:
The backplane is segmented into multiple vertical vent openings distributed across its surface, allowing airflow to be divided into multiple parallel paths rather than passing through a single large opening. This segmentation reduces turbulence and impedance while maintaining total airflow volume, thereby cooling components without increasing airflow resistance.
Solution Approach 2:
The patent transitions from horizontal airflow openings to vertical vent openings oriented in the vertical dimension. This dimensional change allows airflow to pass through the backplane in a direction that aligns with the natural convection currents and reduces interference with storage device operations, thereby reducing airflow impedance while maintaining cooling effectiveness.
2Temperature
If airflow openings are increased to improve cooling, then cooling effectiveness improves, but acoustic noise and vibration increase
Solution Approach 1:
Different regions of the backplane are assigned different functions: vertical vent openings are positioned to provide cooling airflow to specific component areas, while horizontal airflow openings are minimized or eliminated in regions where they would cause noise and vibration. This localized optimization allows effective cooling without generating harmful acoustic noise and vibration.
Solution Approach 2:
The patent converts the potential harm of airflow-induced vibration and noise into a benefit by carefully positioning vertical vent openings to align with structural support elements. The airflow passing through these vertically oriented openings creates pressure distribution that stabilizes rather than vibrates the backplane, thereby reducing acoustic noise and vibration while maintaining cooling effectiveness.
3Speed
If vertical vent openings are aligned with channels between divider walls, then airflow velocity increases, but manufacturing complexity increases
Solution Approach 1:
The vertical vent openings serve multiple functions simultaneously: they provide cooling airflow, align with channels to increase airflow velocity, and are positioned to avoid interference with storage device installation and removal. This multi-functionality is achieved through a standardized backplane design where the vent opening pattern is optimized to satisfy multiple requirements without increasing manufacturing complexity.
Solution Approach 2:
The patent optimizes the parameters of vertical vent openings (size, shape, spacing, and positioning) to achieve maximum airflow velocity alignment with channels. By carefully selecting these parameters within standard manufacturing tolerances, the design achieves high airflow velocity without requiring complex custom manufacturing processes, thereby maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases airflow velocity and reduces component temperatures, improving storage device dynamics performance and reducing acoustic noise and vibration, while supporting higher power configurations without exceeding thermal thresholds.
Implementation Method 1
a fan configured to generate an airflow to cool the plurality of components and the array of storage devices
Implementation Method 2
The backplane comprises a plurality of vertical vent openings, wherein a set of vertical vent openings is aligned with each channel... significantly increases airflow velocity
Data Source
AI summary
A cooling system for cooling a set of components in a compute module and an array of storage devices in a storage module, the array of storage devices comprising rows and columns. The storage module is wider than the compute module to accommodate a larger backplane. The backplane has large vertical vent openings for accommodating connectors of storage devices connecting to the backplane. Pairs of divider walls positioned between adjacent columns of storage devices form large channels for increased airflow between columns of storage devices and reduced airflow between adjacent rows of storage devices. The design allows for increased cooling performance and reduced acoustic energy (noise).