Storage Module Shielding Heat Conduction
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Solution Overview
Problem
Conventional solid state drives (SSDs) face overheating issues due to inadequate heat dissipation, which affects their operational efficiency.
Innovation Solution
The storage module structure incorporates an upper and lower shielding component with protruding heat-conducting units that facilitate thermal energy transfer from the memory component to an external structure, and between adjacent storage module structures, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional SSD structure is used with direct soldering of chips on circuit board, then manufacturing is simple, but heat dissipation is insufficient causing overheating
Solution Approach 1:
The shielding component is divided into upper and lower parts with multiple protruding heat-conducting units, segmenting the heat dissipation function into multiple contact points that collectively improve thermal management without requiring complete structural redesign
Solution Approach 2:
The shielding component serves dual functions: electromagnetic shielding and heat dissipation. The protruding heat-conducting units extend the thermal conduction path while maintaining the protective shielding structure, eliminating the need for separate heat dissipation components
2Temperature
If heat-conducting units are added to shielding component, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat-conducting units are integrated directly into the shielding component as protruding structures, merging the electromagnetic shielding function with the heat dissipation function into a single unified component, thereby reducing the total part count and simplifying assembly processes
3Area of stationary object
If storage module structures are arranged adjacently, then space utilization is improved, but heat accumulation increases between modules
Solution Approach 1:
The protruding heat-conducting units of adjacent storage module structures contact each other, creating a thermal bridge that acts as an intermediary heat conduction path. This allows heat to be transferred laterally between modules rather than accumulating, enabling closer spacing while maintaining thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the operating temperature of memory components, improves heat dissipation efficiency, and prevents operational inefficiencies caused by overheating.
Implementation Method 1
The heat-conducting units are in contact with an external structure. A thermal energy generated by the memory component is conducted to the external structure through the contact of the plurality of heat-conducting units with the external structure.
Implementation Method 2
Every two adjacent storage module structures contact each other through corresponding heat-conducting units. The thermal energy is conducted from one storage module structure to another adjacent storage module structure through the heat-conducting units of the upper shielding component.
Data Source
AI summary
A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.