Semiconductor Storage Package Layout for Compact Heat Dissipation
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Solution Overview
Problem
Semiconductor storage devices face challenges in heat dissipation, which can impact their performance and efficiency.
Innovation Solution
The semiconductor storage device incorporates a heatsink with fins and a capacitor assembly mounted on a substrate, where the capacitor overlaps with the semiconductor chip in the thickness direction, and a heat conducting sheet is used to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is added to improve heat dissipation, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heatsink is integrated with the capacitor assembly structure, merging the heat dissipation function with the existing capacitor mounting structure. This reduces device complexity by eliminating separate heat dissipation components while maintaining effective heat dissipation performance through the combined structure.
Solution Approach 2:
The heatsink structure serves multiple functions: it provides heat dissipation for the capacitor, acts as a mounting structure for the capacitor assembly, and contributes to the overall structural support of the device. This multi-functionality reduces the need for additional separate components, thereby reducing device complexity.
2Volume of moving object
If the capacitor is mounted overlapping with the semiconductor chip in the thickness direction, then space utilization is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The capacitor is mounted in the thickness direction (Z-axis) overlapping with the semiconductor chip, utilizing the vertical dimension for space optimization. Simultaneously, the heatsink extends in the planar direction (X-Y plane) to provide sufficient heat dissipation surface area, effectively resolving the conflict between vertical space utilization and horizontal heat dissipation requirements.
Solution Approach 2:
The heatsink is divided into multiple fin structures that extend vertically, creating segmented heat dissipation surfaces. This segmentation increases the effective heat dissipation surface area within the available vertical space, allowing effective heat dissipation without requiring excessive horizontal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation by effectively dissipating heat generated by the semiconductor chip and capacitors, enhancing the device's performance and efficiency.
Implementation Method 1
a heatsink having fins; and a capacitor mounted in the heatsink
Implementation Method 2
a heatsink having fins
Implementation Method 3
a heat conducting sheet is used to enhance heat dissipation
Data Source
AI summary
A semiconductor storage device has a substrate, a semiconductor chip, a capacitor, and a heatsink. The semiconductor chip is mounted on the substrate. The capacitor is mounted on the substrate and overlaps with the semiconductor chip in a thickness direction of the substrate. The heatsink has fins and the capacitor is mounted in the heatsink.