Semiconductor Storage Package Layout for PCB Heat Dissipation
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Solution Overview
Problem
Existing semiconductor storage devices face challenges in improving heat dissipation efficiency due to limited heat dissipation areas and poor thermal conductivity from point contact between terminals and the printed circuit board.
Innovation Solution
The semiconductor storage device is designed with a terminal arrangement that allows for expanded surface contact with a thermal interface material (TIM) by reducing the number of terminals in certain rows and providing a larger contact area, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If terminals are arranged in a conventional grid pattern with uniform spacing, then electrical connectivity is maintained, but heat dissipation area is limited due to point contact
Solution Approach 1:
The patent transitions from point contact (0D) to line contact (1D) by extending the terminal contact structure along the PCB surface. The terminal rows are arranged to create extended contact lines rather than discrete points, increasing the dimensional complexity of the contact interface and thereby expanding heat dissipation area.
Solution Approach 2:
The terminal structure is divided into multiple rows (first row, second row, third row) with different spacing configurations. This segmentation allows optimization of each row's function: outer rows provide structural support and heat dissipation, while inner rows provide electrical connectivity, resolving the contradiction between connectivity and heat dissipation area.
2Area of stationary object
If terminal spacing is reduced to increase contact area, then heat dissipation area improves, but manufacturing precision requirements increase
Solution Approach 1:
Different spacing configurations are applied to different rows of terminals based on their functional requirements. The first and third rows have smaller spacing to maximize heat dissipation area, while the second row has larger spacing to ensure reliable electrical connectivity. This localized optimization resolves the contradiction by applying different quality standards to different parts of the terminal structure.
3Volume of moving object
If terminal rows are arranged close together to maximize space utilization, then device compactness improves, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies different spacing configurations to different rows: the first row has smaller spacing for compactness, the second row has larger spacing for heat dissipation, and the third row has smaller spacing for compactness. This creates a alternating pattern that locally optimizes both compactness and thermal performance, resolving the contradiction between device footprint and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by increasing the heat dissipation area through surface contact with the TIM, overcoming the limitations of point contact and thermal resistance in previous designs.
Implementation Method 1
The contact area comes in contact with a thermal interface material (TIM) attached to the printed circuit board, thereby improving heat dissipation efficiency
Data Source
AI summary
According to one embodiment, a semiconductor storage device includes a plurality of terminals. The plurality of terminals form at least a first row and a second row. The first row includes a plurality of terminals arranged in a first direction at intervals from each other at locations closer to a first end edge than to a second end edge. The second row includes a plurality of terminals arranged in the first direction at intervals from each other at locations closer to the second end edge than to the first end edge. An area between the first row and the second row on a first surface includes a contact area that is in contact with a heat-conducting member, which is disposed on a printed circuit board in a host device that is electrically connected to the semiconductor storage device.