Semiconductor Storage Package Structure for High-Speed Signal Reliability
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Solution Overview
Problem
Semiconductor storage devices face challenges with high-speed signal interfaces due to material mismatches in printed circuit boards, leading to warping and stress issues from thermal and external forces, which are not effectively addressed by existing low dielectric loss tangent materials.
Innovation Solution
The semiconductor storage device design incorporates a flexible substrate made of low dielectric loss tangent material between an insulating substrate and an interface substrate, supported by heat conductive sheets that relieve stress and improve connection reliability, while also using a two-layer or three-layer metal structure with electromagnetic shielding for high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a printed circuit board is made entirely of low dielectric loss tangent material, then high-speed signal transmission is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by making only the surface layer of the printed circuit board from low dielectric loss tangent material, while the base layer uses ordinary materials. This localized application of high-performance material optimizes signal transmission where needed (at the signal interface) while controlling overall manufacturing costs.
2Ease of manufacture
If a printed circuit board uses mixed materials to reduce cost, then manufacturing cost decreases, but warping occurs due to material mismatch
Solution Approach 1:
The patent uses composite materials by combining a low dielectric loss tangent material layer with an ordinary material base layer. The composite structure is designed with attention to material compatibility, and stress relief structures are incorporated to manage the inherent mismatches between different materials, preventing warping while maintaining cost advantages.
Solution Approach 2:
The printed circuit board is segmented into distinct layers with different material properties - a surface layer for high-speed signal transmission and a base layer for structural support and cost control. This segmentation allows each layer to be optimized for its specific function while managing the interactions between materials.
3Ease of operation
If through holes are formed in mixed-material PCB, then electrical connection is achieved, but adhesion of copper plating becomes difficult
Solution Approach 1:
The patent introduces intermediary layers or transition structures at the through-hole interfaces between different materials. These intermediary elements facilitate proper adhesion of copper plating across material boundaries by providing compatible surface properties and stress distribution, ensuring reliable electrical connections through the mixed-material structure.
4Strength
If mother board is screwed directly to rigid housing, then mechanical fixation is achieved, but stress from temperature changes and external forces cannot be relieved
Solution Approach 1:
The patent transitions from a static, rigid fixation system to a dynamic one by incorporating flexible substrates and stress relief structures. These elements allow the mother board to flex and adapt to thermal expansion and external forces, maintaining mechanical fixation while relieving accumulated stresses that would otherwise compromise reliability.
Solution Approach 2:
The patent employs flexible substrate structures that can deform elastically in response to thermal and mechanical stresses. These flexible elements act as stress relief mechanisms, absorbing expansion and contraction forces while maintaining electrical and mechanical connections, thereby protecting the rigid housing and mounted components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and durability of semiconductor storage devices by reducing stress and improving high-frequency signal transmission, ensuring accurate positioning of components and increased resistance to external impacts and temperature changes.
Implementation Method 1
a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing
Implementation Method 2
a first flexible substrate connecting the insulating substrate and the interface substrate... it is necessary to relieve stresses generated inside the mother board because of environmental temperature changes or external forces
Data Source
AI summary
A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.