Semiconductor Storage Substrate Support for Stress Relief

The patent applies local quality by providing recessed portions at specific locations where connectors are mounted on the substrate. These recessed portions are not uniformly distributed but are strategically placed at connector locations to locally reduce stress concentration. This allows the substrate to maintain overall rigidity while providing localized stress relief where needed, resolving the contradiction between structural stability and stress concentration.

The substrate design incorporates recessed portions only at specific connector locations rather than making the entire substrate flexible. This localized approach allows stress concentration to be reduced at critical points while the rest of the substrate maintains its structural integrity and rigidity. The recessed portions act as localized stress relief features without compromising overall substrate strength.

The patent divides the substrate into regions with different properties by creating recessed portions at specific locations. Instead of adding external support structures, the substrate itself is segmented into raised and recessed areas. This segmentation allows the substrate to inherently resist distortion at connector locations without requiring additional support components, thus improving stability while avoiding increased device complexity.

Rather than uniformly increasing substrate thickness, the patent segments the substrate thickness by creating recessed portions at specific locations. This allows the substrate to have varying effective thickness - thinner at connector locations to reduce stress concentration, and maintaining normal thickness elsewhere for overall structural strength. This segmented approach achieves deformation resistance without the manufacturing complexity and cost associated with uniformly thick substrates.