Semiconductor device and method of manufacturing semiconductor device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in achieving both high heat dissipation and low production cost, as the heat dissipation path requires components with high thermal conductivity and large heat capacity, while the terminals need to be thin for workability and cost considerations.
Innovation Solution
A semiconductor device design that includes a heat spreader, a semiconductor element, a metal block with high thermal conductivity, and thinner terminals, where the metal block is bonded to the semiconductor element and extends to straddle above it, with an insulating member connecting to the heat spreader, and a sealing material encapsulating the components to facilitate efficient heat transfer and reduce production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal block with high thermal conductivity and large heat capacity is used for heat dissipation, then heat dissipation performance is improved, but production cost increases
Solution Approach 1:
The heat dissipation path is segmented into multiple components: a heat spreader made of aluminum or aluminum alloy (lower cost material) and a metal block made of copper or copper alloy (high thermal conductivity material). The heat spreader handles bulk heat distribution while the metal block provides targeted high-performance heat dissipation at critical points, reducing overall material cost while maintaining effective heat dissipation.
Solution Approach 2:
High thermal conductivity copper material is applied locally at the metal block where direct bonding to the semiconductor element occurs and maximum heat transfer efficiency is needed. The heat spreader uses lower-cost aluminum material for areas where moderate heat dissipation is sufficient. This localized application of high-performance material optimizes the balance between heat dissipation performance and production cost.
2Temperature
If a thick terminal is used for heat dissipation, then heat dissipation performance is improved, but workability and production cost worsen
Solution Approach 1:
The terminal structure is segmented into two functional parts: a thick metal block portion that contacts the semiconductor element for efficient heat absorption, and a thin plate portion that extends outward for connection to external circuits. This segmentation allows the terminal to provide adequate heat dissipation at the bonding interface while maintaining thin dimensions for improved workability and reduced production cost in the external connection portion.
Solution Approach 2:
The terminal has different thicknesses at different locations: a thicker section at the bonding area where heat dissipation is critical, and a thinner section at the external connection area where workability is prioritized. This local variation in thickness optimizes both heat dissipation performance and ease of handling during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective heat dissipation from both the front and back surfaces of the semiconductor element, balancing high thermal performance with low production costs, suitable for applications like electric vehicle inverter circuits.
Implementation Method 1
The metal block includes a bonding surface and at least one heat dissipating surface. The bonding surface is bonded to the front surface electrode of the semiconductor element. The at least one heat dissipating surface is connected to the upper surface of the heat spreader with interposition of the insulating member.
Implementation Method 2
The heat is released to the cooler through a heat spreader or the like. The semiconductor element is mounted on an upper surface of the heat spreader.
Data Source
AI summary
Provided is a semiconductor device having excellent heat dissipation at low cost. The semiconductor device includes a heat spreader, a semiconductor element, a metal block, a terminal having a plate shape, and a sealing material. The semiconductor element includes a front surface electrode and is mounted on an upper surface of the heat spreader. The metal block includes a bonding surface bonded to the front surface electrode and a heat dissipating surface connected to the upper surface with interposition of the insulating member. The metal block is provided so as to straddle above one side of the semiconductor element. The first end of the terminal is bonded to the metal block. The second end of the terminal is exposed from the sealing material and formed to be connectable to an external circuit. The sealing material seals the heat spreader, the semiconductor element, the metal block, and the first end.