Straight Wirebonding Silicon Dies Vertical Edge Stacking
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Solution Overview
Problem
Existing silicon die architectures require staggering of dice for connection, leading to increased space requirements and potential stress on stacked dies due to overhanging upper dies, which can cause cracking.
Innovation Solution
Electrically connecting silicon dice along their vertical edges using edge-mounted connection pads, allowing for vertical stacking without staggering, and utilizing conductive elements and solder blocks to form connections, thereby reducing lateral space requirements and freeing up space for transistor formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection pads are placed on top or bottom of silicon dice, then electrical connection between dice is achieved, but lateral space requirements increase due to staggered stacking arrangement
Solution Approach 1:
The connection pads are moved from the top/bottom surfaces to the vertical side surfaces of the silicon dice. This dimensional relocation allows dice to be stacked vertically in direct alignment without requiring lateral staggering, thereby reducing the overall lateral footprint while maintaining electrical connectivity through the side-mounted pads
2Reliability
If connection pads are placed on top or bottom of silicon dice, then electrical connection is achieved, but space for transistor formation is reduced
Solution Approach 1:
By relocating connection pads to the vertical side surfaces of the dice, the top and bottom surfaces are freed from connection pad requirements. This allows the entire top and bottom surfaces to be utilized for transistor formation and other active device fabrication, maximizing the usable area for functional components
3Reliability
If dice are staggered for connection, then electrical connection between dice is achieved, but stress on stacked dies increases causing potential cracking
Solution Approach 1:
Moving connection pads to the vertical side surfaces enables direct vertical stacking of dice without lateral offsets. This eliminates the overhang condition that creates mechanical stress and cracking risks, as each die sits directly on the one below it, distributing weight uniformly and eliminating stress concentration points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a smaller form factor for integrated devices by allowing vertical stacking of silicon dice without the need for staggering, reducing the risk of die cracking and optimizing space usage for transistor formation.
Implementation Method 1
applying heat to reflow the solder to cause the solder to physically and electrically couple the one or more portions of the linear conductor to the one or more connection pads in contact therewith
Data Source
AI summary
A method including stacking a number of silicon dice such that one or more edges of the dice are in vertical alignment, where the one or more edges include a number of connection pads. The method also includes positioning a connecting wire on a substantially perpendicular axis to the one or more edges. The connecting wire includes a number of solder blocks formed thereon. The solder blocks are spaced at intervals associated with a distance between a first set of aligned connection pads on the dice. The connecting wire is positioned such that the solder blocks are in contact with the first set of aligned connection pads. The method also includes applying heat to cause the solder blocks to reflow and physically and electrically couple the connecting wire to the connection pads.