Direct-ink-writing Strain Gauge Array Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The matrix circuit design for strain gauge arrays faces issues with cross insulation between horizontal and longitudinal circuits, leading to raised steps and potential open circuits under tensile stress due to current bridging and gluing methods.
Innovation Solution
A novel direct-ink-writing method for printing strain gauge array circuits involves forming insulating layers, conductive silver lines, and strain gauge electrodes, using through holes for insulation and regional glue dispensing to ensure accurate and stable circuit connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bridging and gluing method is used to ensure cross insulation between horizontal and longitudinal circuits, then insulation between circuits is improved, but raised steps are generated affecting printing accuracy and open circuits occur under tensile stress
Solution Approach 1:
The patent divides the circuit structure into separate horizontal and longitudinal layers with insulating material positioned between them. This segmentation eliminates the need for bridging and gluing at cross positions, as each layer is independently formed and insulated, preventing raised steps and maintaining printing accuracy while ensuring circuit insulation.
2Reliability
If bridging and gluing method is used to ensure cross insulation between horizontal and longitudinal circuits, then insulation between circuits is improved, but raised steps are generated affecting printing accuracy
Solution Approach 1:
The patent transitions from a planar two-dimensional circuit layout to a three-dimensional layered structure. By positioning insulating material in the vertical dimension between horizontal and longitudinal circuits, insulation is achieved without requiring lateral bridging and gluing operations, thus eliminating raised steps that would affect subsequent printing accuracy.
3Reliability
If bridging and gluing method is used to ensure cross insulation between horizontal and longitudinal circuits, then insulation between circuits is improved, but open circuits occur under tensile stress
Solution Approach 1:
The patent incorporates insulating material during the initial printing process before the circuits are subjected to tensile stress. By pre-positioning the insulating material between layers and allowing it to cure, a robust insulating structure is formed that can withstand subsequent tensile stresses without causing open circuits, eliminating the need for fragile post-printing bridging and gluing operations.
Data Source
AI summary
A novel direct-ink-writing (DIW) method for printing a strain gauge array circuit is disclosed. Firstly, the whole circuit is layered by a 3D printing method; a thin layer of insulating material is printed on the first circuit layer, instead of printing an insulating bridge, to form the second insulating layer; a part needing to contact the second insulating layer is not printed, but one through hole is reserved; the second circuit layer is then printed; the functional layer of the strain gauge is finally covered; the electrodes on the functional layer can contact the second circuit layer or can contact the first circuit layer through the through holes, which ensures that the functional layer contacts the two circuit layers, and also ensures the insulation in a cross part of a matrix circuit; the printing of the array strain gauge is effectively completed; and the stability of measurement is ensured.