Strain Gauge Pressure Sensor Diaphragm Integration

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Solution Overview

Problem

Existing pressure transducers face challenges in minimizing size while maintaining performance and reliability, particularly in space-constrained environments, due to the configuration of internal components which can compromise integrity and increase the risk of wire damage during assembly.

Innovation Solution

The design features a pressure sensor assembly with a pressure port, fluid passageway, and diaphragm, where the sensing element is mounted on the outer surface of the diaphragm, and wire bonding pads are arranged in parallel planes with the diaphragm, allowing for simplified electrical coupling using wire bonding machines and reduced risk of wire damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the transducer size is reduced to meet space limitations, then the overall package size decreases, but the internal component arrangement becomes more constrained and complex

Engineering Contradiction:
Improvetransducer sizeVSAvoidinternal component arrangement
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the diaphragm and the electronics package mounting surface into a single integrated structure. The flat surface of the diaphragm serves dual purposes: as the pressure-sensitive element and as the mounting surface for the electronics package, eliminating the need for separate mounting structures and reducing overall complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the planar dimension of the diaphragm surface to mount the electronics package, transitioning from a three-dimensional stacked arrangement to a two-dimensional planar integration. This reduces the height dimension of the transducer while maintaining all necessary functional separations

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional wire routing methods are used, then electrical connections are established, but the risk of wire damage during assembly increases

Engineering Contradiction:
Improvewire connection processVSAvoidwire integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces flat cables as an intermediary element between the sensing element and the electronics package. These flat cables route wires through a protective channel in the housing, shielding them from damage during assembly and operation while maintaining electrical connectivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent provides protective channels and routing paths for wires before assembly is complete. The housing structure includes pre-formed channels that guide and protect wires from mechanical damage during the assembly process, preventing wire breakage before it occurs

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If specialized connectors are used for electrical connections, then connection reliability improves, but device complexity and size increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidconnector requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the connector function from the overall device design. By integrating wire bonding pads directly onto the diaphragm surface and using flat cables for connection, the design eliminates the need for specialized connectors while maintaining reliable electrical connections through simplified wire bonding technology

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables a compact pressure transducer with improved reliability and reduced risk of wire damage during assembly, facilitating efficient electrical connections and maintaining performance without the need for specialized connectors.

Implementation Method 1

Pressure sensing transducers incorporating micro fused silicon strain gauge technology

Methodology Applied
Scientific EffectStrain gauge: Piezoresistive Effect

Data Source

PatentEP2950070B1Strain gauge pressure sensor
Publication Date: 2019.09.18 SENSATA TECHNOLOGIES INC
  • EP2950070B1 patent drawingFigure 1~4
  • EP2950070B1 patent drawingFigure 5~9
  • EP2950070B1 patent drawingFigure 10~13

AI summary

A pressure transducer assembly that includes a pressure-responsive diaphragm (34) to which a sensing element is mounted and an electronic package (36) that includes wire-bonding pads adapted be electrically connected to the sensing element by wire bonding equipment. The diaphragm and wire bonding pads are supported within the transducer so that they lie in proximity to each other and in non-intersecting planes.